Silicon wafer (Si Wafer)
Lub silicon wafer yog dab tsi?
Ib daim silicon wafer yog ib daim ntawv nyias nyias uas ua los ntawm kev txiav, sib tsoo, thiab txhuam cov monocrystalline silicon ingots uas muaj cov khoom siv siab; nws ua haujlwm ua cov khoom siv tseem ceeb rau kev tsim cov integrated circuits, cov khoom siv fais fab, MEMS sensors, photovoltaic thiab cov khoom siv optical. Cov khoom siv hluav taws xob ntawm wafer (resistivity, doping type), geometric accuracy (tuab, TTV, warpage), thiab qhov zoo ntawm qhov chaw (roughness, particle size) ncaj qha txiav txim siab qhov txiaj ntsig thiab kev sib xws ntawm cov khoom siv hauv cov txheej txheem tom ntej xws li epitaxial growth, photolithography, thiab coating; yog li ntawd, kev xaiv thiab kev taug qab ntawm wafers yog qhov tseem ceeb rau cov kab ntau lawm ntawm cov neeg siv khoom.
Cov khoom lag luam silicon wafer ntawm Semicera Laboratory muaj ntau yam ntu, txij li cov substrates wafer liab qab mus rau cov substrates ua haujlwm; nws tso cai rau kev hloov kho ntawm ntau yam txheej txheem kev loj hlob ntawm crystal, kev txiav kev taw qhia, thiab kev daws teeb meem kev kho saum npoo raws li cov txheej txheem tsim khoom (epitaxy, oxidation, bonding, MEMS processing).
Pkab khoom
Pawg no suav nrog cov khoom me hauv qab no, txhua yam muaj nyob rau hauv cov lus qhia tshwj xeeb:
| Pkhoom | Mcov yam ntxwv ntawm ain | Cov Ntawv Thov Ib Txwm Muaj |
| Txheej silicon nyias nyias uas tswj tau qhov tuab mus txog rau qhov ntau ntawm submicron | SOI device layer, thin-film sensor | |
| Qhov chaw tiaj tiaj siab–ib sab los yog ob sab polishing | MEMS thiab cov khoom siv fais fab; kev loj hlob epitaxial; kev txheeb xyuas cov txheej txheem dav dav | |
| Txoj kev CZ–dav dav resistivity ntau yam | Kev tsim khoom IC, cov khoom siv sib cais | |
| Koog tsev kawm ntawv yaj (tsis muaj crucible), ultra-high resistivity, cov pa oxygen tsawg | Cov khoom siv fais fab, cov khoom kuaj, cov ntawv thov zaus siab / RF | |
| SiO uas loj hlob ntawm qhov chaw₂txheej rwb thaiv tsev nrog kev tswj tau tuab | MEMS txheej cais thiab kev tshawb fawb capacitor / dielectric |
Cov Qauv Txuj Ci Tseem Ceeb
Cov npe hauv qab no teev cov qauv tshwj xeeb uas hloov kho tau rau cov khoom silicon wafer; cov nqi tseeb yog raws li Daim Ntawv Pom Zoo Kev Txiav Txim:
| Cov Qauv | Qhov ntau yam | Piav qhia |
| Txoj kab uas hla ntawm lub wafer | 2″–12″(50–300 hli) | Txhawb cov ntawv qauv me me uas tsim tshwj xeeb |
| Hom kev loj hlob ntawm Crystal | CZ (Txoj kev Czochralski) / FZ (Txoj kev yaj hauv cheeb tsam) | FZ yog tsim los rau ultra-high resistivity thiab low-oxygen ib puag ncig. |
| kev taw qhia siv lead ua | (100),(111),(110) | Sib phim rau cov kev cai ntawm cov txheej txheem downstream |
| Hom tshuaj doping | N-hom / P-hom | Cov ntsiab lus doping: phosphorus, arsenic, boron, thiab lwm yam. |
| kev tiv taus | 0.001–10,000Ω·cm | Cov txheej txheem FZ ua rau kev ua haujlwm hauv thaj chaw muaj kev tiv thaiv siab. |
| qhov sib txawv ntawm qhov tuab | ±10–25 μm (nyob ntawm qhov loj me) | Raws li lub cheeb ntawm lub cheeb nce, tus qauv tuab nce raws li. |
| Tag Nrho Thickness Variation (TTV) | ≤1–5 μm | Cuam tshuam rau qhov tob ntawm daim teb photolithography thiab kev sib txuas ua ke |
| Qhwv/Hneev | ≤5–20 μm | Cov ntawv loj loj xav tau kev tswj hwm kev warpage nruj dua. |
| Qhov roughness ntawm qhov chaw (Ra) | Qhov ntsuas sub-nanometer (qhov chaw ci ntsa iab) | Cuam tshuam rau kev nplaum ntawm cov zaj duab xis nyias thiab kev ua haujlwm hluav taws xob ntawm lub cuab yeej |
| kev ua ntug | Ntug voj voog / Chamfer–ua raws li cov qauv SEMI | Txo qhov tawg ntawm ntug thiab cov khoom me me uas muaj kuab paug |
| lub xeev nto | Kev txhuam ib sab (SSP) / Kev txhuam ob sab (DSP) | DSP yog qhov tsim nyog rau kev sib txuas thiab MEMS cov txheej txheem tsim khoom. |
Lus Cim: Txoj kev CZ siv lub quartz crucible rau kev loj hlob ntawm cov siv lead ua; cov txheej txheem no tau tsim zoo thiab tsim nyog tus nqi, tab sis cov pa oxygen uas lub crucible tau qhia txwv qhov siab tshaj plaws ntawm resistivity. Qhov sib txawv, txoj kev FZ tsis siv lub crucible, ua rau muaj cov pa oxygen tsawg heev thiab ua rau muaj cov nqi resistivity siab dua thiab sib npaug dua.–ua rau nws tsim nyog rau cov ntawv thov uas muaj kev tiv thaiv siab xws li cov khoom siv fais fab thiab cov khoom kuaj. Qhov sib txawv ntawm cov txheej txheem tsim khoom no ua haujlwm ua qhov tseem ceeb thaum xaiv cov khoom siv lossis txoj kev tsim khoom.
Cov Txheej Txheem Tsim Khoom thiab Kev Ntsuas
Tag nrho cov txheej txheem yog ua tiav hauv ib puag ncig chav huv uas tswj tau; rau txhua cov txheej txheem tseem ceeb, cov ntaub ntawv tshuaj xyuas ntxaws ntxaws tau khaws cia kom ntseeg tau tias cov kev ntsuas sib xws thiab taug qab tau thoob plaws cov pawg.
Athaj chaw thov
- •Kev tsim cov khoom siv sib xyaw ua ke: Ua cov khoom siv rau cov khoom siv logic thiab nco
- •Cov khoom siv hluav taws xob semiconductor: IGBTs, MOSFETs, Schottky diodes, thiab lwm yam khoom siv uas rhiab heev rau kev tiv thaiv siab thiab qhov tsis zoo tsawg.
- •MEMS thiab Sensors: Siv cov wafers ci ntsa iab ob sab thiab cov wafers thermal oxidation los tsim cov txheej txheem thiab cov txheej cais tawm.
- •Cov Khoom Siv RF/High-Frequency: Cov khoom siv silicon uas tsis kam siab txo qhov poob dielectric, ua rau lawv haum rau 5G cov lim dej thiab cov hloov pauv modules.
- •Photovoltaics thiab Optics: Ua ib lub substrate rau txheej thiab optical reference specimens
- •Kev Tshawb Fawb thiab Kev Txheeb Xyuas Cov Txheej Txheem: Cov qauv me me uas tau hloov kho rau cov kab ntau lawm hauv chaw kuaj mob thiab cov kab tsim khoom sim
Vim li cas ho xaiv peb?
- Cov ntaub ntawv sib xyaw ua ke muaj peev xwm: Lub tuam txhab tswj cov kab khoom lag luam uas suav nrog silicon carbide (SiC) coatings, quartz, graphite, carbon fiber, thiab wafer khoom, ua rau nws muab kev txhawb nqa cov khoom siv kawg rau cov khoom siv semiconductor thiab cov neeg siv khoom tsim wafer.–es tsis yog tsuas yog muab cov khoom siv ywj pheej xwb.
- Kev tsim khoom tshwj xeeb: Kev hloov kho tsis yog tus qauv muaj nyob rau ntawm cov txheej txheem tshwj xeeb uas tus neeg siv khoom muab (piv txwv li, resistivity, crystal orientation, thickness, TTV), thiab kev lees paub cov qauv me me yog txhawb nqa.
- Kev Tswj Xyuas Zoo thiab Kev Ntsuas Peev Xwm:Cov txheej txheem tsim khoom yuav raug kuaj xyuas raws li SEMI cov qauv (tag nrho-lossis-tsis muaj lossis random sampling ntawm cov yam ntxwv tseem ceeb xws li resistivity, TTV, warpage, thiab qhov loj ntawm cov khoom nto); cov ntaub ntawv tsim nyog thiab daim ntawv pov thawj tuaj yeem pom ntawmNplooj ntawv Kev Tsim Nyog thiab Kev Hwm.
Cov Lus Nug Feem Ntau (FAQ)
Q: Yuav tsum xaiv li cas ntawm CZ silicon wafers thiab FZ silicon wafers?
A: Rau cov ntawv thov uas tus nqi yog qhov txhawj xeeb tseem ceeb thiab qhov yuav tsum tau ua kom tsis txhob muaj zog poob rau hauv qhov qis-rau-nruab nrab, CZ silicon wafers sawv cev rau kev xaiv pheej yig dua; txawm li cas los xij, rau cov ntawv thov (piv txwv li, cov khoom siv hluav taws xob siab lossis cov khoom siv kuaj) uas xav tau kev tiv thaiv siab heev thiab sib xws nrog rau cov pa oxygen tsawg heev, FZ silicon wafers raug pom zoo.
Q: Qhov txawv ntawm kev txhuam ib sab (SSP) thiab kev txhuam ob sab (DSP) yog dab tsi?
A: SSP muaj qhov ua tiav zoo li daim iav ntawm ib sab xwb thiab muab tus nqi qis dua, ua rau nws tsim nyog rau cov txheej txheem epitaxial thiab photolithography ib txwm muaj; DSP muaj cov nplaim ci ntsa iab ntawm ob sab, muab qhov tiaj tiaj dua thiab qhov huv si zoo dua, thiab feem ntau siv rau hauv kev sib txuas, MEMS daim ntawv thov, lossis cov txheej txheem uas cov kev cai zoo rov qab raug yuam.
Q: Qhov kev pabcuam puas txhawb nqa cov qhov ntev tsis yog tus qauv lossis cov qauv me me?
A: Kev Txhawb Nqa–Lub cheeb, tuab, crystallographic orientation, thiab kev kho qhov chaw tuaj yeem hloov kho raws li tus neeg siv khoom's drawings los yog specification yuav tsum tau; cov qauv kuaj yuav muab rau kev txheeb xyuas ua ntej mus rau pawg ntau lawm.
Q: Peb yuav ua li cas thiaj paub tseeb tias cov wafer parameters ua tau raws li peb cov kab ntau lawm?
A: Peb pom zoo kom muab cov hom phiaj resistivity, crystal orientation, thickness tolerance, TTV/deflection requirements, thiab surface condition (SSP/DSP); raws li cov lus qhia no, peb yuav muab cov lus qhia xaiv thiab daim ntawv qhia kev sim.
Thov Ib Daim Ntawv Qhia Txog Kev Hais Nqe thiab Cov Ntaub Ntawv Txog Kev Siv Tshuab
Yog xav tau cov lus hais txog cov khoom siv silicon wafer tshwj xeeb, rub tawm daim ntawv teev cov khoom siv, lossis tham txog cov kev daws teeb meem uas tsis yog tus qauv, thov xa koj daim ntawv thov ntawm"Tiv Tauj Peb",peb yuav teb tsis pub dhau 24 teev.
