Kev sib tham luv luv ntawm cov txheej txheem photoresist txheej

Cov txheej txheem txheej txheem ntawm photoresist feem ntau muab faib ua spin txheej, dip txheej thiab yob txheej, ntawm cov txheej txheej yog feem ntau siv. Los ntawm cov txheej txheej txheej, photoresist yog dripped rau ntawm lub substrate, thiab lub substrate tuaj yeem tig ntawm kev kub ceev kom tau txais cov yeeb yaj kiab photoresist. Tom qab ntawd, cov yeeb yaj kiab tuaj yeem tau txais los ntawm cua sov rau ntawm lub phaj kub. Spin txheej yog tsim rau txheej los ntawm ultra-thin films (txog 20nm) mus rau tuab zaj duab xis txog 100um. Nws cov yam ntxwv zoo sib xws, cov yeeb yaj kiab tsis sib xws ntawm wafers, ob peb qhov tsis xws luag, thiab lwm yam, thiab cov yeeb yaj kiab nrog cov txheej txheem siab tuaj yeem tau txais.

 

Spin txheej txheej txheem

Thaum lub sij hawm tig txheej, lub ntsiab kev sib hloov ceev ntawm lub substrate txiav txim siab cov yeeb yaj kiab thickness ntawm photoresist. Kev sib raug zoo ntawm kev sib hloov ceev thiab zaj duab xis thickness yog raws li nram no:

Spin = kTn

Hauv cov mis, Spin yog qhov kev sib hloov ceev; T yog zaj duab xis thickness; k thiab n yog qhov qub.

 

Cov yam ntxwv cuam tshuam rau cov txheej txheem spin txheej

Txawm hais tias zaj duab xis thickness yog txiav txim los ntawm lub ntsiab kev sib hloov ceev, nws kuj muaj feem xyuam rau chav tsev kub, av noo, photoresist viscosity thiab photoresist hom. Kev sib piv ntawm ntau hom photoresist txheej nkhaus yog qhia hauv daim duab 1.

Photoresist txheej txheej txheem (1)

Daim duab 1: Kev sib piv ntawm ntau hom photoresist txheej nkhaus

Kev cuam tshuam ntawm lub sijhawm hloov pauv loj

Qhov luv luv lub sij hawm tig lub ntsiab, qhov tuab ntawm zaj duab xis thickness. Thaum lub sij hawm tig lub ntsiab yog nce, lub thinner zaj duab xis ua. Thaum nws tshaj 20s, zaj duab xis thickness tseem yuav luag tsis hloov. Yog li ntawd, lub sij hawm tig lub ntsiab feem ntau yog xaiv ntau tshaj 20 vib nas this. Kev sib raug zoo ntawm lub sijhawm tig lub ntsiab thiab cov yeeb yaj kiab tuab yog qhia hauv daim duab 2.

Photoresist txheej txheej txheem (9)

Daim duab 2: Kev sib raug zoo ntawm lub sij hawm tig lub ntsiab thiab zaj duab xis thickness

Thaum lub photoresist yog dripped mus rau lub substrate, txawm tias lub ntsiab kev sib hloov ceev yog tib yam, kev sib hloov ceev ntawm lub substrate thaum lub dripping yuav cuam tshuam rau qhov kawg zaj duab xis thickness. Lub thickness ntawm cov yeeb yaj kiab photoresist nce nrog qhov nce ntawm cov substrate rotation ceev thaum lub sij hawm dripping, uas yog vim muaj kev cuam tshuam ntawm cov kuab tshuaj evaporation thaum lub photoresist yog unfolded tom qab dripping. Daim duab 3 qhia txog kev sib raug zoo ntawm zaj duab xis thickness thiab lub ntsiab rotation ceev ntawm sib txawv substrate rotation speeds thaum lub photoresist dripping. Nws tuaj yeem pom los ntawm daim duab uas nrog qhov nce ntawm kev sib hloov ceev ntawm cov dej ntws tawm, cov yeeb yaj kiab thickness hloov sai dua, thiab qhov sib txawv yog qhov pom tseeb dua hauv cheeb tsam nrog qis dua lub ntsiab kev sib hloov ceev.

Photoresist txheej txheej txheem (3) (1)

Daim duab 3: Kev sib raug zoo ntawm zaj duab xis thickness thiab lub ntsiab rotation ceev ntawm qhov sib txawv substrate rotation speeds thaum photoresist dispensing

 

Cov nyhuv ntawm cov av noo thaum txheej txheej

Thaum cov av noo txo ​​qis, zaj duab xis thickness nce, vim tias qhov txo qis hauv cov av noo txhawb cov evaporation ntawm cov kuab tshuaj. Txawm li cas los xij, cov yeeb yaj kiab thickness faib tsis hloov pauv loj. Daim duab 4 qhia txog kev sib raug zoo ntawm cov av noo thiab zaj duab xis thickness faib thaum txheej txheej.

Photoresist txheej txheej txheem (4) (1)

Daim duab 4: Kev sib raug zoo ntawm cov av noo thiab zaj duab xis thickness faib thaum txheej txheej

 

Cov nyhuv ntawm qhov kub thiab txias thaum txheej txheej

Thaum qhov kub ntawm sab hauv tsev nce, zaj duab xis thickness nce. Nws tuaj yeem pom los ntawm daim duab 5 tias qhov photoresist zaj duab xis thickness faib hloov ntawm convex mus rau concave. Qhov nkhaus nyob rau hauv daim duab kuj qhia tau hais tias lub siab tshaj plaws uniformity yog tau thaum lub sab hauv tsev kub yog 26 ° C thiab photoresist kub yog 21 ° C.

Photoresist txheej txheej txheem (2) (1)

Daim duab 5: Kev sib raug zoo ntawm qhov kub thiab cov yeeb yaj kiab thickness faib thaum txheej txheej

 

Cov nyhuv ntawm cov pa tawm nrawm thaum txheej txheej

Daim duab 6 qhia txog kev sib raug zoo ntawm cov pa ceev thiab cov yeeb yaj kiab thickness faib. Nyob rau hauv qhov tsis muaj pa, nws qhia tau hais tias qhov chaw ntawm lub wafer nyhav thicken. Ua kom lub tso pa ceev yuav txhim kho cov uniformity, tab sis yog hais tias nws yog nce ntau heev, lub uniformity yuav txo. Nws tuaj yeem pom tau tias muaj qhov zoo tshaj plaws rau qhov tso pa tawm ceev.

Photoresist txheej txheej txheem (5)

Daim duab 6: Kev sib raug zoo ntawm cov pa ceev thiab cov yeeb yaj kiab thickness faib

 

HMDS kev kho mob

Txhawm rau ua kom cov photoresist coatable ntau dua, lub wafer yuav tsum tau kho nrog hexamethyldisilazane (HMDS). Tshwj xeeb tshaj yog thaum ya raws txuas mus rau saum npoo ntawm Si oxide zaj duab xis, silanol yog tsim, uas txo cov adhesion ntawm photoresist. Txhawm rau tshem tawm cov dej noo thiab decompose silanol, wafer feem ntau yog cua sov rau 100-120 ° C, thiab huab cua HMDS tau qhia ua rau muaj tshuaj lom neeg. Cov txheej txheem tshuaj tiv thaiv tau pom nyob rau hauv daim duab 7. Los ntawm kev kho HMDS, hydrophilic nto nrog lub kaum sab xis me me dhau los ua ib qho chaw hydrophobic nrog lub kaum sab xis loj. Cua sov lub wafer tuaj yeem tau txais photoresist adhesion ntau dua.

Photoresist txheej txheej txheem (10)

Daim duab 7: HMDS cov tshuaj tiv thaiv mechanism

 

Cov nyhuv ntawm HMDS kev kho mob tuaj yeem pom los ntawm kev ntsuas lub kaum sab xis. Daim duab 8 qhia txog kev sib raug zoo ntawm HMDS lub sij hawm kho mob thiab kev sib cuag lub kaum sab xis (kev kho kub 110 ° C). Lub substrate yog Si, lub sij hawm kho HMDS yog ntau dua 1min, lub kaum sab xis ntawm kev sib cuag yog ntau dua 80 °, thiab cov nyhuv kho tau ruaj khov. Daim duab 9 qhia txog kev sib raug zoo ntawm HMDS kev kho kub thiab kev sib cuag lub kaum sab xis (lub sijhawm kho 60s). Thaum qhov kub siab tshaj 120 ℃, lub kaum sab xis ntawm kev sib cuag yuav txo qis, qhia tias HMDS decomposes vim cua sov. Yog li, HMDS kev kho mob feem ntau ua tau ntawm 100-110 ℃.

Photoresist txheej txheej txheem (3)

Daim duab 8: Kev sib raug zoo ntawm HMDS lub sijhawm kho

thiab kev sib cuag lub kaum sab xis (kev kho kub 110 ℃)

Photoresist txheej txheej txheem (3)

Daim duab 9: Kev sib raug zoo ntawm HMDS kev kho kub thiab kev sib cuag lub kaum sab xis (lub sijhawm kho 60s)

 

HMDS kev kho mob yog ua ntawm silicon substrate nrog ib tug oxide zaj duab xis los tsim ib tug photoresist qauv. Cov oxide zaj duab xis yog ces etched nrog hydrofluoric acid nrog ib tug tsis ntxiv, thiab nws tau pom tias tom qab HMDS kev kho mob, tus qauv photoresist tuaj yeem khaws cia kom tsis txhob poob. Daim duab 10 qhia txog cov nyhuv ntawm HMDS kev kho mob (cov qauv loj yog 1um).

Photoresist txheej txheej txheem (7)

Daim duab 10: HMDS kev kho mob (cov qauv loj yog 1um)

 

Prebaking

Nyob rau tib qhov kev sib hloov ceev, qhov siab dua qhov prebaking kub, qhov me me ntawm zaj duab xis thickness, uas qhia tau hais tias qhov siab dua qhov prebaking kub, qhov hnyav dua evaporates, uas ua rau cov yeeb yaj kiab tuab. Daim duab 11 qhia txog kev sib raug zoo ntawm qhov ntsuas kub ua ntej thiab Dill's A parameter. Tus A parameter qhia qhov concentration ntawm tus neeg sawv cev photosensitive. Raws li tuaj yeem pom los ntawm daim duab, thaum qhov kub ua ntej ci nce mus rau saum 140 ° C, qhov ntsuas A txo qis, qhia tias tus neeg sawv cev photosensitive decomposes ntawm qhov kub siab tshaj qhov no. Daim duab 12 qhia txog qhov spectral transmittance ntawm qhov sib txawv ua ntej ci kub. Ntawm 160 ° C thiab 180 ° C, qhov nce ntawm kev xa tuaj yeem pom nyob rau hauv lub wavelength ntau ntawm 300-500nm. Qhov no lees paub tias tus neeg sawv cev photosensitive yog ci thiab decomposed ntawm qhov kub thiab txias. Qhov kub ua ntej ci muaj qhov zoo tshaj plaws, uas yog txiav txim los ntawm lub teeb yam ntxwv thiab rhiab heev.

Photoresist txheej txheej txheem (7)

Daim duab 11: Kev sib raug zoo ntawm pre-baking kub thiab Dill's A parameter

( ntsuas tus nqi ntawm OFPR-800/2)

Photoresist txheej txheej txheem (6)

Daim duab 12: Spectral transmittance ntawm qhov sib txawv ua ntej ci kub

(OFPR-800, 1um zaj duab xis thickness)

 

Nyob rau hauv luv luv, cov txheej txheem spin txheej muaj qhov tshwj xeeb zoo xws li kev tswj cov yeeb yaj kiab tuab, kev ua haujlwm siab, cov txheej txheem me me, thiab kev ua haujlwm yooj yim, yog li nws muaj cov txiaj ntsig tseem ceeb hauv kev txo cov pa phem, txuag hluav taws xob, thiab txhim kho cov nqi ua haujlwm. Nyob rau hauv xyoo tas los no, cov txheej txheem spinning tau txais kev mloog ntau ntxiv, thiab nws daim ntawv thov tau maj mam kis mus rau ntau qhov chaw.


Post lub sij hawm: Nov-27-2024