Cov txheej txheem tam sim no rau kev ntim khoom semiconductor tau maj mam txhim kho, tab sis qhov twg cov khoom siv thiab cov thev naus laus zis tau txais kev pom zoo hauv cov ntim khoom semiconductor ncaj qha txiav txim siab qhov ua tiav ntawm cov txiaj ntsig xav tau.Cov txheej txheem ntim khoom semiconductor uas twb muaj lawm tseem raug kev txom nyem los ntawm kev lag luam tsis xws luag, thiab cov kws tshaj lij kev lag luam tsis tau siv tag nrho cov khoom ntim khoom ntim tshuab.Yog li ntawd, cov txheej txheem ntim khoom semiconductor uas tsis muaj kev txhawb nqa los ntawm kev tswj cov thev naus laus zis yuav ua rau muaj kev ua haujlwm ntau dua thiab cov nqi sijhawm, ua rau nws nyuaj rau cov kws tshaj lij txhawm rau tswj xyuas qhov zoo ntawm cov khoom ntim semiconductor.
Ib qho ntawm cov ntsiab lus tseem ceeb rau kev txheeb xyuas yog qhov cuam tshuam ntawm cov txheej txheem ntim khoom ntawm kev ntseeg siab ntawm cov khoom qis-k.Kev ncaj ncees ntawm cov kub-aluminium bonding hlau interface yog cuam tshuam los ntawm tej yam xws li lub sij hawm thiab qhov kub thiab txias, ua rau nws kev cia siab rau poob rau lub sij hawm thiab ua rau cov kev hloov nyob rau hauv nws cov tshuaj theem, uas yuav ua rau delamination nyob rau hauv tus txheej txheem.Yog li ntawd, nws yog ib qho tseem ceeb uas yuav tau xyuam xim rau kev tswj kom zoo ntawm txhua theem ntawm cov txheej txheem.Tsim pab pawg tshwj xeeb rau txhua txoj haujlwm tuaj yeem pab tswj cov teeb meem no kom zoo.Nkag siab txog cov hauv paus ntsiab lus ntawm cov teeb meem tshwm sim thiab tsim cov phiaj xwm, cov kev daws teeb meem txhim khu kev qha yog qhov tseem ceeb rau kev tswj xyuas tag nrho cov txheej txheem zoo.Tshwj xeeb tshaj yog, thawj cov xwm txheej ntawm cov xov hlau sib txuas, nrog rau cov ntaub ntawv sib txuas thiab cov ntaub ntawv thiab cov qauv, yuav tsum tau ua tib zoo txheeb xyuas.Cov ntaub qhwv ntsej muag yuav tsum tau ua kom huv si, thiab kev xaiv thiab siv cov ntaub ntawv sib txuas, cov cuab yeej sib txuas, thiab kev sib txuas yuav tsum ua raws li cov txheej txheem yuav tsum tau ua kom siab tshaj plaws.Nws raug pom zoo kom muab k tooj liab txheej txheem thev naus laus zis nrog kev sib raug zoo-pitch los xyuas kom meej tias qhov cuam tshuam ntawm kub-aluminium IMC ntawm kev cia siab rau ntim yog qhov tseem ceeb heev.Rau qhov zoo-pitch bonding xov hlau, txhua qhov deformation tuaj yeem cuam tshuam qhov loj ntawm cov khoom sib txuas thiab txwv tsis pub IMC cheeb tsam.Yog li ntawd, kev tswj xyuas kom zoo thaum lub sijhawm ua haujlwm yog qhov tsim nyog, nrog cov pab pawg thiab cov neeg ua haujlwm tau tshawb xyuas lawv cov dej num tshwj xeeb thiab kev lav phib xaub, ua raws li cov txheej txheem thiab cov cai los daws cov teeb meem ntxiv.
Kev siv dav dav ntawm cov khoom ntim semiconductor muaj kev ua haujlwm zoo.Cov kws tshaj lij hauv kev lag luam yuav tsum ua raws li cov kauj ruam ua haujlwm ntawm cov khoom ntim semiconductor kom tswj cov khoom kom zoo.Txawm li cas los xij, qee tus neeg ua haujlwm hauv tuam txhab tsis siv cov txheej txheem txheej txheem los ua kom tiav cov txheej txheem ntim khoom semiconductor thiab txawm tsis quav ntsej los txheeb xyuas cov kev qhia tshwj xeeb thiab cov qauv ntawm cov khoom siv semiconductor.Yog li ntawd, qee cov khoom siv semiconductor tau ntim tsis raug, tiv thaiv cov khoom siv hluav taws xob los ntawm kev ua nws cov haujlwm yooj yim thiab cuam tshuam rau kev lag luam cov txiaj ntsig kev lag luam.
Zuag qhia tag nrho, cov txheej txheem ntawm kev ntim khoom semiconductor tseem xav tau kev txhim kho kom zoo.Cov kws tshaj lij hauv cov chaw tsim khoom lag luam semiconductor yuav tsum siv cov khoom ntim khoom ntim khoom kom zoo kom ntseeg tau tias muaj kev sib dhos ntawm tag nrho cov khoom siv semiconductor.Cov neeg soj ntsuam zoo yuav tsum ua kom tiav thiab nruj xyuas kom raug txheeb xyuas cov khoom siv semiconductor tsis raug thiab tam sim ntawd yaum cov kws kho mob kom kho tau zoo.
Tsis tas li ntawd, nyob rau hauv cov ntsiab lus ntawm kev sib txuas ntawm cov txheej txheem kev tswj kom zoo, kev sib cuam tshuam ntawm cov hlau txheej thiab ILD txheej hauv cov hlau sib txuas tuaj yeem ua rau delamination, tshwj xeeb tshaj yog thaum cov hlau sib txuas thiab cov txheej txheem hlau / ILD txheej deform rau hauv lub khob. .Qhov no feem ntau yog vim lub siab thiab lub zog ultrasonic siv los ntawm cov hlau sib txuas tshuab, uas maj mam txo lub zog ultrasonic thiab xa mus rau thaj tsam hlau sib txuas, cuam tshuam kev sib tshuam ntawm cov kub thiab txhuas atoms.Nyob rau hauv thawj theem, kev ntsuam xyuas ntawm low-k chip hlau bonding qhia tau hais tias kev sib txuas cov txheej txheem tsis muaj rhiab heev.Yog tias cov kev sib txuas tsis tau teeb tsa tsawg dhau, cov teeb meem zoo li cov hlau tawg thiab cov ntawv cog lus tsis muaj zog yuav tshwm sim.Ua kom lub zog ultrasonic kom them rau qhov no tuaj yeem ua rau lub zog poob thiab ua rau lub khob zoo li deformation.Tsis tas li ntawd, qhov tsis muaj zog adhesion ntawm ILD txheej thiab txheej hlau, nrog rau cov brittleness ntawm cov ntaub ntawv uas tsis muaj k, yog thawj qhov laj thawj rau delamination ntawm cov hlau txheej los ntawm ILD txheej.Cov yam tseem ceeb no yog cov teeb meem tseem ceeb hauv cov txheej txheem ntim khoom semiconductor tam sim no kev tswj xyuas zoo thiab kev tsim kho tshiab.
Post lub sij hawm: May-22-2024