Pem Hauv Ntej Kawg ntawm Kab (FEOL): Tso lub Foundation

Sab pem hauv ntej, nruab nrab thiab rov qab kawg ntawm semiconductor manufacturing kab ntau lawm

Cov txheej txheem tsim khoom semiconductor tuaj yeem faib ua peb theem:
1) Pem hauv ntej kawg ntawm kab
2) Nruab nrab ntawm kab
3) Rov qab kawg ntawm kab

Peb tuaj yeem siv qhov piv txwv yooj yim xws li tsim lub tsev los tshawb txog cov txheej txheem nyuaj ntawm chip manufacturing:

Lub hauv ntej kawg ntawm cov kab ntau lawm zoo li tso lub hauv paus thiab tsim cov phab ntsa ntawm lub tsev. Hauv kev tsim khoom semiconductor, theem no suav nrog kev tsim cov qauv tsim thiab transistors ntawm silicon wafer.

Cov kauj ruam tseem ceeb ntawm FEOL:

1.Kev ntxuav: Pib nrog nyias silicon wafer thiab ntxuav nws kom tshem tawm cov impurities.
2.Oxidation: Loj hlob ib txheej ntawm silicon dioxide ntawm lub wafer kom cais qhov sib txawv ntawm cov nti.
3.Photolithography: Siv photolithography rau etch cov qauv mus rau wafer, zoo li kos duab blueprints nrog lub teeb.
4.Etching: Etch tshem pliaj silicon dioxide kom pom cov qauv xav tau.
5.Doping: Qhia impurities rau hauv silicon los hloov nws cov khoom hluav taws xob, tsim cov transistors, lub hauv paus tsev blocks ntawm tej nti.

Mid End of Line (MEOL): Txuas cov Dots

Qhov nruab nrab ntawm cov kab ntau lawm yog zoo li txhim kho cov xaim thiab cov kav dej hauv tsev. Cov theem no tsom rau kev tsim kev sib txuas ntawm cov transistors tsim nyob rau hauv FEOL theem.

Cov kauj ruam tseem ceeb ntawm MEOL:

1.Dielectric Deposition: Deposit insulating txheej (hu ua dielectrics) los tiv thaiv cov transistors.
2.Contact Formation: Tsim kev sib cuag los txuas cov transistors rau ib leeg thiab lub ntiaj teb sab nraud.
3.Interconnect: Ntxiv cov txheej hlau los tsim txoj hauv kev rau cov teeb liab hluav taws xob, zoo ib yam li cov xaim hluav taws xob hauv tsev kom paub meej seamless zog thiab cov ntaub ntawv ntws.

Rov qab kawg ntawm kab (BEOL): Ua tiav kov

Lub nraub qaum kawg ntawm cov kab ntau lawm zoo li ntxiv qhov kawg kov rau lub tsev - txhim kho cov khoom siv, pleev xim, thiab ua kom txhua yam ua haujlwm. Hauv kev tsim khoom semiconductor, theem no suav nrog ntxiv cov txheej txheem kawg thiab npaj cov nti rau ntim.

Cov kauj ruam tseem ceeb ntawm BEOL:

1.Additional Hlau Layers: Ntxiv ntau txheej hlau los txhim kho kev sib txuas, kom ntseeg tau tias cov nti tuaj yeem ua haujlwm nyuaj thiab nrawm.
2.Passivation: Siv cov txheej txheem tiv thaiv los tiv thaiv cov nti ntawm ib puag ncig kev puas tsuaj.
3.Testing: Kawm cov nti rau kev sim nruj kom ntseeg tau tias nws ua tau raws li txhua qhov tshwj xeeb.
4.Dicing: Txiav cov wafer rau hauv ib qho chips, txhua tus npaj rau ntim thiab siv hauv cov khoom siv hluav taws xob.

Semicera yog ib lub chaw tsim khoom OEM hauv Suav teb, mob siab rau muab tus nqi tshwj xeeb rau peb cov neeg siv khoom. Peb muab ntau yam khoom zoo thiab kev pabcuam, suav nrog:

1.CVD SiC txheej(Epitaxy, kev cai CVD-coated qhov chaw, cov txheej txheem ua haujlwm siab rau kev siv semiconductor, thiab ntau dua)
2.CVD SiC Bulk Parts(Etch rings, tsom rings, kev cai SiC Cheebtsam rau cov khoom siv semiconductor, thiab ntau dua)
3.CVD TaC Coated Parts(Epitaxy, SiC wafer loj hlob, kev siv kub kub, thiab lwm yam)
4.Graphite Parts(Graphite nkoj, kev cai graphite Cheebtsam rau kev ua haujlwm kub, thiab ntau dua)
5.SiC Parts(SiC nkoj, SiC rauv raj, kev cai SiC Cheebtsam rau kev ua cov khoom siv siab heev, thiab ntau dua)
6.Quartz Parts(Quartz nkoj, kev cai quartz qhov chaw rau semiconductor thiab hnub ci industries, thiab ntau dua)

Peb txoj kev mob siab rau kev ua tau zoo ua kom peb muab cov kev daws teeb meem tshiab thiab txhim khu kev qha rau ntau yam kev lag luam, suav nrog kev tsim khoom semiconductor, kev ua cov ntaub ntawv qib siab, thiab kev siv high-tech. Nrog rau kev tsom mus rau precision thiab zoo, peb tau mob siab rau ua tau raws li qhov tshwj xeeb xav tau ntawm txhua tus neeg siv khoom.