Txoj kev npaj ntawm feem ntau TaC coated graphite qhov chaw

PART/1
CVD (Chemical Vapor Deposition) txoj kev:
Ntawm 900-2300 ℃, siv TaCl₅thiab CnHm li tantalum thiab carbon qhov chaw, H₂ raws li kev txo cua, Ar₂as cab kuj gas, cov tshuaj tiv thaiv deposition zaj duab xis. Cov txheej txheej npaj yog compact, uniform thiab siab purity. Txawm li cas los xij, muaj qee qhov teeb meem xws li cov txheej txheem nyuaj, tus nqi kim, kev tswj cov huab cua tsis yooj yim thiab kev tso nyiaj tsawg.
PART/2
Slurry sintering txoj kev:
Cov slurry uas muaj cov pa roj carbon monoxide, tantalum qhov chaw, dispersant thiab binder yog coated rau ntawm graphite thiab sintered ntawm kub kub tom qab ziab. Cov txheej txheej npaj loj hlob tsis tu ncua, muaj tus nqi qis thiab tsim nyog rau kev tsim khoom loj. Nws tseem yuav tsum tau tshawb nrhiav kom ua tiav cov txheej txheem thiab cov txheej txheem tag nrho ntawm cov graphite loj, tshem tawm cov kev txhawb nqa tsis xws luag thiab txhim kho cov txheej txheem sib txuas.
PART/3
Plasma txau txoj kev:
TaC hmoov yog yaj los ntawm plasma arc ntawm qhov kub thiab txias, atomized rau hauv qhov kub thiab txias los ntawm lub dav hlau ceev ceev, thiab txau rau ntawm cov khoom siv graphite. Nws yog ib qho yooj yim los tsim oxide txheej nyob rau hauv uas tsis yog-vacuum, thiab lub zog noj yog loj.

 

Daim duab. Wafer tais tom qab siv hauv GaN epitaxial zus MOCVD ntaus ntawv (Veeco P75). Ib qho ntawm sab laug yog coated nrog TaC thiab ib qho ntawm sab xis yog coated nrog SiC.

TAC coatedgraphite qhov chaw yuav tsum tau daws

PART/1
Lub zog khi:
Lub thermal expansion coefficient thiab lwm yam khoom ntawm lub cev ntawm TaC thiab carbon cov ntaub ntawv sib txawv, cov txheej txheem kev sib raug zoo yog tsawg, nws yog ib qho nyuaj kom tsis txhob muaj kab nrib pleb, pores thiab thermal stress, thiab lub txheej yog yooj yim tev tawm nyob rau hauv qhov tseeb huab cua uas muaj rot. rov nce thiab txias txheej txheem.
PART/2
Purity:
TAC txheejyuav tsum muaj ultra-siab purity kom tsis txhob impurities thiab muaj kuab paug nyob rau hauv high kub tej yam kev mob, thiab cov txheej txheem zoo thiab cov yam ntxwv ntawm cov dawb carbon thiab intrinsic impurities nyob rau saum npoo thiab sab hauv ntawm tag nrho cov txheej yuav tsum tau pom zoo.
PART/3
Kev ruaj ntseg:
Qhov kub thiab txias tsis kam thiab tshuaj lom neeg ua haujlwm siab tshaj 2300 ℃ yog qhov ntsuas tseem ceeb tshaj plaws los ntsuas qhov ruaj khov ntawm txheej. Pinholes, kab nrib pleb, cov ces kaum uas ploj lawm, thiab ib qho kev taw qhia ib thaj tsam lis yog ib qho yooj yim ua rau corrosive gases nkag mus rau hauv graphite, ua rau cov txheej txheem tiv thaiv tsis ua hauj lwm.
PART/4
Oxidation kuj:
TaC pib oxidize rau Ta2O5 thaum nws siab tshaj 500 ℃, thiab oxidation tus nqi nce sharply nrog rau qhov kub thiab txias concentration. Qhov saum npoo oxidation pib los ntawm cov ciam teb thiab cov nplej me me, thiab maj mam tsim cov kab nrib pleb thiab cov pob zeb tawg, ua rau muaj ntau qhov khoob thiab qhov, thiab oxygen infiltration intensifies kom txog thaum lub txheej yog stripped. Qhov tshwm sim oxide txheej muaj cov thermal conductivity tsis zoo thiab ntau yam xim hauv qhov tsos.
PART/5
Uniformity thiab roughness:
Kev faib tawm tsis sib xws ntawm cov txheej txheej tuaj yeem ua rau cov thermal stress concentration hauv zos, ua rau muaj kev pheej hmoo ntawm kev tawg thiab tawg. Tsis tas li ntawd, qhov roughness ntawm qhov chaw ncaj qha cuam tshuam rau kev sib cuam tshuam ntawm txheej txheej thiab ib puag ncig sab nraud, thiab qhov roughness siab dhau yuav ua rau muaj kev sib txhuam nrog cov wafer thiab tsis sib xws thermal field.
PART/6
Grain loj:
Lub uniform grain loj pab lub stability ntawm txheej. Yog tias cov qoob loo me me, cov ntawv cog lus tsis nruj, thiab nws yooj yim rau oxidized thiab corroded, ua rau muaj ntau cov kab nrib pleb thiab qhov nyob rau hauv cov ntug nplej, uas txo cov kev tiv thaiv ntawm cov txheej. Yog hais tias cov nplej loj dhau lawm, nws yog qhov ntxhib heev, thiab cov txheej txheej yog yooj yim rau flake tawm hauv qab thermal stress.