Kawm txog semiconductor tuagkev sib txuas lus, nrog rau cov txheej txheem nplaum nplaum, cov txheej txheem eutectic bonding, cov txheej txheem muag muag muag, cov txheej txheem nyiaj sintering bonding, txheej txheem kub nias, txheej txheem flip chip bonding. Cov hom thiab cov cim qhia tseem ceeb ntawm cov khoom siv semiconductor tuag bonding yog qhia, qhov kev loj hlob raug tshuaj xyuas, thiab kev loj hlob zoo yog prospected.
1 Txheej txheem cej luam ntawm semiconductor kev lag luam thiab ntim khoom
Kev lag luam semiconductor tshwj xeeb suav nrog cov khoom siv hluav taws xob thiab cov khoom siv hluav taws xob, cov khoom siv hluav taws xob nruab nrab, thiab cov ntawv siv qis. kuv lub teb chaws txoj kev lag luam semiconductor pib lig, tab sis tom qab ze li kaum xyoo ntawm kev loj hlob sai, kuv lub teb chaws tau dhau los ua lub ntiaj teb loj tshaj plaws semiconductor cov neeg siv khoom lag luam thiab lub ntiaj teb loj tshaj plaws semiconductor khoom lag luam. Kev lag luam semiconductor tau txhim kho sai heev nyob rau hauv hom ntawm ib tiam ntawm cov khoom siv, ib tiam ntawm cov txheej txheem, thiab ib tiam ntawm cov khoom. Kev tshawb fawb ntawm cov txheej txheem semiconductor thiab cov khoom siv yog lub hauv paus tsav tsheb rau kev nce qib ntawm kev lag luam thiab kev lav phib xaub rau kev lag luam thiab kev tsim khoom loj ntawm cov khoom semiconductor.
Txoj kev loj hlob keeb kwm ntawm semiconductor ntim tshuab yog keeb kwm ntawm kev txhim kho txuas ntxiv ntawm kev ua haujlwm ntawm cov nti thiab txuas ntxiv miniaturization ntawm cov tshuab. Lub zog tsav sab hauv ntawm ntim tshuab tau hloov zuj zus los ntawm thaj chaw ntawm high-end smartphones mus rau thaj chaw xws li kev ua haujlwm siab thiab kev txawj ntse. Plaub theem ntawm kev loj hlob ntawm semiconductor ntim tshuab yog qhia nyob rau hauv Table 1.
Raws li cov txheej txheem semiconductor lithography nodes txav mus rau 10 nm, 7 nm, 5 nm, 3 nm, thiab 2 nm, R & D thiab cov nqi tsim khoom txuas ntxiv nce, tus nqi tawm los txo qis, thiab Moore Txoj Cai qeeb. Los ntawm cov kev pom ntawm kev tsim kev lag luam kev lag luam, tam sim no txwv tsis pub muaj cov nqi ntawm kev tsim khoom, kev ua haujlwm siab, kev ua haujlwm siab, kev kub siab thiab kev sib koom siab. Kev lag luam semiconductor tau nkag mus rau tom qab Moore era, thiab cov txheej txheem siab heev tsis yog tsuas yog tsom mus rau kev nce qib ntawm wafer manufacturing technology nodes, tab sis maj mam tig mus rau qib siab ntim tshuab. Advanced ntim tshuab tuaj yeem tsis tsuas yog txhim kho kev ua haujlwm thiab nce cov khoom muaj nqis, tab sis kuj txo cov nqi tsim khoom, ua ib txoj hauv kev tseem ceeb los mus txuas ntxiv Moore Txoj Cai. Ntawm qhov tod tes, cov thev naus laus zis tseem ceeb yog siv los faib cov txheej txheem nyuaj rau hauv ntau lub ntim thev naus laus zis uas tuaj yeem ntim rau hauv cov ntim khoom sib txawv thiab ntau yam. Ntawm qhov tod tes, kev sib xyaw ua ke thev naus laus zis yog siv los ua ke cov khoom siv ntawm cov khoom sib txawv thiab cov qauv, uas muaj qhov tshwj xeeb ua haujlwm zoo. Kev sib koom ua ke ntawm ntau lub zog thiab cov khoom siv ntawm cov khoom sib txawv yog pom tau los ntawm kev siv tshuab microelectronics, thiab kev txhim kho los ntawm kev sib xyaw ua ke mus rau kev sib xyaw ua ke tau pom.
Semiconductor ntim yog qhov pib ntawm kev tsim cov khoom siv nti thiab tus choj ntawm lub ntiaj teb sab hauv ntawm cov nti thiab cov txheej txheem sab nraud. Tam sim no, ntxiv rau cov tsoos semiconductor ntim thiab kuaj cov tuam txhab, semiconductorwaferfoundries, semiconductor tsim tuam txhab uas muag, thiab integrated tivthaiv tuam txhab uas muag yog nquag txhim kho kev ntim khoom siab heev los yog lwm yam tseem ceeb ntim technologies.
Cov txheej txheem tseem ceeb ntawm kev ntim khoom siv tshuab yogwaferthinning, txiav, tuag bonding, hlau bonding, yas sealing, electroplating, tav txiav thiab molding, thiab lwm yam. cov khoom siv tseem ceeb tshaj plaws hauv kev ntim khoom semiconductor, thiab yog ib qho ntawm cov khoom ntim khoom nrog cov nqi lag luam siab tshaj plaws. Txawm hais tias cov txheej txheem ntim khoom siv qib siab siv cov txheej txheem pem hauv ntej xws li lithography, etching, metallization, thiab planarization, cov txheej txheem ntim tseem ceeb tshaj plaws tseem yog txheej txheem kev sib khi tuag.
2 Semiconductor tuag bonding txheej txheem
2.1 Txheej txheem cej luam
Cov txheej txheem kev tuag tseem hu ua chip loading, core loading, tuag bonding, chip bonding txheej txheem, thiab lwm yam. Cov txheej txheem tuag bonding yog qhia nyob rau hauv daim duab 1. Feem ntau hais lus, tuag bonding yog khaws cov nti ntawm lub wafer siv lub vuam taub hau. suction nozzle siv lub tshuab nqus tsev, thiab muab tso rau ntawm qhov chaw ntim ntawm cov khoom siv lead ua los yog ntim cov substrate nyob rau hauv kev taw qhia pom, kom cov nti thiab cov ntaub ntawv sib txuas. thiab kho. Qhov zoo thiab kev ua haujlwm ntawm cov txheej txheem kev sib khi tuag yuav cuam tshuam ncaj qha rau qhov zoo thiab kev ua haujlwm ntawm cov hlau txuas txuas ntxiv, yog li kev sib txuas tuag yog ib qho ntawm cov thev naus laus zis tseem ceeb hauv cov txheej txheem semiconductor rov qab kawg.
Rau cov txheej txheem ntim khoom semiconductor sib txawv, tam sim no muaj rau lub ntsiab tuag kev sib txuas cov txheej txheem thev naus laus zis, uas yog cov nplaum nplaum, eutectic bonding, soft solder bonding, silver sintering bonding, hot pressing bonding, and flip-chip bonding. Yuav kom ua tiav cov khoom sib txuas zoo, nws yog ib qho tsim nyog yuav tsum ua kom cov txheej txheem tseem ceeb hauv cov txheej txheem kev tuag sib koom ua ke, feem ntau suav nrog cov khoom sib txuas, qhov kub thiab txias, lub sijhawm, siab thiab lwm yam.
2. 2 Adhesive bonding txheej txheem
Thaum lub sij hawm sib txuas ua ke, qee qhov ntawm cov nplaum yuav tsum tau siv rau ntawm cov hlau lead lossis pob substrate ua ntej muab cov nti, thiab tom qab ntawd lub taub hau tuag lub taub hau khaws cov nti, thiab los ntawm kev taw qhia lub tshuab pom, cov nti tau raug muab tso rau hauv kev sib txuas. txoj hauj lwm ntawm cov hlau lead thav duab los yog pob substrate coated nrog nplaum, thiab ib tug tej yam tuag bonding quab yuam yog siv rau lub nti los ntawm lub tuag bonding tshuab taub hau, tsim ib tug nplaum txheej ntawm lub nti thiab cov hlau lead thav duab lossis pob substrate, thiaj li ua tiav lub hom phiaj ntawm kev sib txuas, txhim kho thiab kho cov nti. Cov txheej txheem kev sib khi tuag no tseem hu ua cov txheej txheem kua nplaum vim tias cov nplaum yuav tsum tau siv rau pem hauv ntej ntawm lub tshuab sib khi tuag.
Feem ntau siv cov nplaum muaj xws li cov khoom siv semiconductor xws li epoxy resin thiab conductive silver paste. Adhesive bonding yog feem ntau siv semiconductor nti tuag bonding txheej txheem vim cov txheej txheem kuj yooj yim, tus nqi qis, thiab ntau yam khoom siv tau.
2.3 Eutectic bonding txheej txheem
Thaum lub sij hawm eutectic bonding, eutectic bonding khoom feem ntau yog pre-applied rau hauv qab ntawm lub nti los yog cov hlau lead ncej. Cov cuab yeej sib txuas eutectic khaws cov nti thiab tau coj los ntawm lub tshuab pom qhov system kom raug muab cov nti tso rau ntawm qhov sib txuas sib txuas ntawm cov hlau lead ncej. Cov nti thiab cov hlau lead ncej tsim ib qho kev sib txuas ntawm eutectic sib txuas ntawm cov nti thiab cov pob substrate nyob rau hauv kev sib xyaw ua ke ntawm cua sov thiab siab. Cov txheej txheem eutectic bonding feem ntau yog siv rau hauv cov khoom siv lead ua thiab ceramic substrate ntim.
Eutectic bonding cov ntaub ntawv feem ntau yog sib xyaw los ntawm ob cov ntaub ntawv ntawm qhov kub thiab txias. Cov khoom siv feem ntau muaj xws li kub thiab tin, kub thiab silicon, thiab lwm yam. Thaum siv cov txheej txheem kev sib txuas ntawm eutectic, qhov kev sib kis ntawm cov khoom siv lead ua nyob rau hauv lub thav duab yuav pre-heat tus ncej. Tus yuam sij rau kev ua tiav ntawm cov txheej txheem eutectic bonding yog tias cov khoom sib txuas eutectic tuaj yeem yaj ntawm qhov kub ntawm qhov qis dua qhov melting point ntawm ob cov khoom siv los tsim ib daim ntawv cog lus. Txhawm rau tiv thaiv lub thav duab los ntawm kev oxidized thaum lub sij hawm eutectic bonding txheej txheem, eutectic bonding txheej txheem kuj feem ntau siv cov roj tiv thaiv xws li hydrogen thiab nitrogen sib xyaw roj kom nkag mus rau hauv txoj kev los tiv thaiv cov hlau lead.
2. 4 Mos solder bonding txheej txheem
Thaum cov khoom muag muag muag, ua ntej muab cov nti, txoj haujlwm sib txuas ntawm cov hlau lead yog tinned thiab nias, los yog muab ob npaug rau tinned, thiab cov hlau lead yuav tsum tau rhuab rau hauv txoj kev. Qhov zoo ntawm cov txheej txheem kev sib txuas ntawm cov mos mos yog qhov zoo thermal conductivity, thiab qhov tsis zoo yog tias nws yooj yim rau oxidize thiab cov txheej txheem kuj nyuaj. Nws yog tsim rau txhuas thav duab ntim cov khoom siv hluav taws xob, xws li transistor txheej txheem ntim.
2. 5 Silver sintering bonding txheej txheem
Cov txheej txheem kev cog lus zoo tshaj plaws rau tam sim no tiam thib peb lub zog hluav taws xob semiconductor nti yog siv cov hlau particle sintering thev naus laus zis, uas sib xyaw cov polymers xws li epoxy resin lub luag haujlwm rau kev sib txuas hauv cov kua nplaum. Nws muaj cov khoom siv hluav taws xob zoo heev, thermal conductivity, thiab cov yam ntxwv ua haujlwm kub kub. Nws tseem yog ib qho tseem ceeb thev naus laus zis rau kev ua tiav ntxiv hauv kev ntim khoom thib peb hauv xyoo tas los.
2.6 Thermocompression bonding txheej txheem
Nyob rau hauv daim ntawv thov ntim ntawm kev ua tau zoo peb-dimensional integrated circuits, vim qhov txo qis ntawm nti interconnect input / output suab, pob loj thiab suab, lub tuam txhab semiconductor Intel tau tsim cov txheej txheem thermocompression bonding rau cov ntawv thov kev sib txuas me me, kev sib txuas me me. pob chips nrog lub suab ntawm 40 mus rau 50 μm lossis txawm 10 μm. Thermocompression bonding txheej txheem yog tsim rau chip-to-wafer thiab nti-rau-substrate daim ntaub ntawv. Raws li cov txheej txheem ntau kauj ruam ceev, cov txheej txheem thermocompression bonding ntsib cov teeb meem hauv cov txheej txheem tswj cov teeb meem, xws li qhov kub tsis sib xws thiab tsis tuaj yeem tswj tau ntawm cov ntim me me. Thaum lub sij hawm thermocompression bonding, qhov kub thiab txias, siab, txoj hauj lwm, thiab lwm yam yuav tsum tau raws li cov kev cai tswj kom meej.
2.7 Flip chip bonding txheej txheem
Lub hauv paus ntsiab lus ntawm flip chip bonding txheej txheem yog qhia nyob rau hauv daim duab 2. Lub flip mechanism khaws cov nti los ntawm lub wafer thiab flips nws 180 ° hloov lub nti. Lub taub hau taub hau nozzle khaws cov nti los ntawm lub flip mechanism, thiab lub pob kev taw qhia ntawm nti yog downward. Tom qab vuam lub taub hau nozzle txav mus rau sab saum toj ntawm lub ntim substrate, nws txav mus rau nqes mus rau daim ntawv cog lus thiab kho cov nti ntawm lub ntim substrate.
Flip nti ntim yog ib qho kev sib txuas ntawm cov chips siab heev thiab tau dhau los ua cov kev taw qhia tseem ceeb ntawm kev ntim khoom siab heev. Nws muaj cov yam ntxwv ntawm kev ua tuab siab, nyias, nyias, nyias thiab tuaj yeem ua tau cov khoom tsim kho hluav taws xob xws li lub xov tooj ntawm cov xov tooj smartphones thiab ntsiav tshuaj. Flip chip bonding txheej txheem ua rau cov nqi ntim qis dua thiab tuaj yeem paub cov chips stacked thiab ntim peb-seem. Nws yog dav siv nyob rau hauv ntim tshuab teb xws li 2.5D / 3D integrated ntim, wafer-theem ntim, thiab system-theem ntim. Flip chip bonding txheej txheem yog siv dav tshaj plaws thiab feem ntau siv cov khoom sib txuas ua ke hauv cov txheej txheem ntim khoom siab heev.
Lub sij hawm xa tuaj: Nov-18-2024