Yuav ua li cas peb tsim-ua cov kauj ruam rau SiC substrates yog raws li nram no:
1. Crystal Orientation: Siv X-ray diffraction los taw qhia cov khoom siv lead ua.Thaum X-ray beam raug coj mus rau lub ntsej muag uas xav tau siv lead ua, lub kaum sab xis ntawm lub teeb pom kev zoo txiav txim siab qhov kev coj ua siv lead ua.
2. Sab Nrauv Sib Tsoo: Ib qho muaju uas loj hlob hauv graphite crucibles feem ntau tshaj cov kab uas hla.Kev sib tsoo sab nraud txo lawv mus rau qhov ntau thiab tsawg.
Xaus ntsej muag sib tsoo: 4-nti 4H-SiC substrates feem ntau muaj ob qhov chaw, thawj thiab theem nrab.Thaum kawg lub ntsej muag sib tsoo opens li no positioning ntug.
3. Hlau Sawing: Hlau sawing yog ib kauj ruam tseem ceeb hauv kev ua 4H-SiC substrates.Kev tawg thiab sub-surface puas tshwm sim thaum lub sij hawm xaim sawing tsis zoo cuam tshuam cov txheej txheem tom ntej, ncua sijhawm ua haujlwm thiab ua rau cov khoom poob.Txoj kev siv ntau tshaj plaws yog ntau txoj hlua saw nrog pob zeb diamond abrasive.Kev sib txuas lus ntawm cov hlau hlau txuas nrog pob zeb diamond abrasives yog siv los txiav 4H-SiC ingot.
4. Chamfering: Txhawm rau tiv thaiv ntug chipping thiab txo cov khoom poob thaum cov txheej txheem tom ntej, cov npoo ntse ntawm cov hlau-sawn chips yog chamfered rau cov duab teev.
5. Thinning: Hlau sawing tawm ntau khawb thiab sub-surface puas.Thinning yog ua tiav siv lub pob zeb diamond log kom tshem tawm cov teeb meem no kom ntau li ntau tau.
6. Kev Sib Tsoo: Cov txheej txheem no suav nrog kev sib tsoo ntxhib thiab kev sib tsoo zoo siv cov me me boron carbide lossis pob zeb diamond abrasives kom tshem tawm cov khoom seem thiab kev puas tsuaj tshiab qhia thaum lub sij hawm thinning.
7. Polishing: Cov kauj ruam kawg suav nrog polishing ntxhib thiab zoo polishing siv alumina lossis silicon oxide abrasives.Cov kua polishing softens saum npoo, uas yog ces mechanically tshem tawm los ntawm abrasives.Cov kauj ruam no ua kom lub ntsej muag du thiab tsis muaj kev puas tsuaj.
8. Kev Tu: Tshem tawm cov khoom, hlau, oxide zaj duab xis, cov organic residues, thiab lwm yam khoom paug tawm ntawm cov kauj ruam ua.
Post lub sij hawm: May-15-2024