Semicera's 8 Nti N-hom SiC Wafers yog nyob rau hauv pem hauv ntej ntawm semiconductor innovation, muab lub hauv paus ruaj khov rau kev txhim kho cov khoom siv hluav taws xob ua tau zoo. Cov wafers no yog tsim los ua kom tau raws li cov kev xav tau ntawm cov khoom siv hluav taws xob niaj hnub no, los ntawm cov hluav taws xob hluav taws xob mus rau cov hluav taws xob ntau zaus.
N-hom doping nyob rau hauv cov SiC wafers txhim kho lawv cov hluav taws xob conductivity, ua rau lawv zoo tagnrho rau ntau yam kev siv, nrog rau lub hwj chim diodes, transistors, thiab amplifiers. Lub superior conductivity ua kom tsawg zog poob thiab ua haujlwm tau zoo, uas yog ib qho tseem ceeb rau cov khoom siv ua haujlwm ntawm qhov siab thiab lub zog.
Semicera siv cov txheej txheem tsim khoom tsim los tsim SiC wafers nrog qhov tshwj xeeb ntawm qhov sib xws thiab qhov tsis xws luag. Qib no ntawm qhov tseeb yog qhov tseem ceeb rau cov ntawv thov uas xav tau kev ua haujlwm zoo ib yam thiab ua haujlwm ntev, xws li hauv aerospace, tsheb, thiab kev sib txuas lus kev lag luam.
Kev koom ua ke ntawm Semicera's 8 Nti N-hom SiC Wafers rau hauv koj cov kab ntau lawm muab lub hauv paus rau kev tsim cov khoom uas tuaj yeem tiv taus ib puag ncig hnyav thiab kub siab. Cov wafers no zoo meej rau kev siv hluav taws xob hloov pauv, RF thev naus laus zis, thiab lwm yam xav tau.
Xaiv Semicera's 8 Nti N-hom SiC Wafers txhais tau tias kev nqis peev hauv cov khoom lag luam uas muab cov khoom siv zoo tshaj plaws nrog kev tsim vaj tsev zoo. Semicera tau cog lus los ua kom muaj peev xwm ntawm cov thev naus laus zis semiconductor, muab cov kev daws teeb meem uas txhim kho kev ua tau zoo thiab kev ntseeg siab ntawm koj cov khoom siv hluav taws xob.
| Cov khoom | Ntau lawm | Kev tshawb fawb | Dummy |
| Crystal Parameters | |||
| Polytype | 4H | ||
| Deg orientation yuam kev | 11-20 > 4 ± 0.15 ° | ||
| Hluav taws xob Parameters | |||
| Dopant | n-hom Nitrogen | ||
| Kev tiv thaiv | 0.015-0.025ohm · cm | ||
| Mechanical Parameters | |||
| Txoj kab uas hla | 150.0 ± 0.2 hli | ||
| Thickness | 350 ± 25 hli | ||
| Thawj qhov chaw tiaj tiaj | [1-100] ± 5° | ||
| Thawj lub tiaj tiaj ntev | 47.5 ± 1.5 hli | ||
| Secondary flat | Tsis muaj | ||
| TTV | ≤ 5 hli | ≤10 hli | ≤ 15 hli |
| LTV | ≤ 3 μm (5mm * 5mm) | ≤ 5 μm (5mm * 5mm) | ≤ 10 μm (5mm * 5mm) |
| Hneev | -15μm ~ 15μm | -35μm ~ 35μm | -45μm ~ 45μm |
| Warp | ≤ 35 hli | ≤ 45 hli | ≤ 55 hli |
| Pem hauv ntej (Si-face) roughness (AFM) | Ra≤0.2nm (5μm * 5μm) | ||
| Qauv | |||
| Micropipe ceev | <1 ea/cm2 | <10 ea/cm2 | <15 ea/cm2 |
| Hlau impurities | ≤5E10 atoms/cm2 | NA | |
| BPD | ≤1500 ea/cm2 | ≤3000 ea/cm2 | NA |
| TSD | ≤500 ea/cm2 | ≤1000 ea/cm2 | NA |
| Pem hauv ntej zoo | |||
| Pem hauv ntej | Si | ||
| Nto tiav | Lub ntsej muag CMP | ||
| Cov khoom | ≤60ea / wafer (qhov loj ≥0.3μm) | NA | |
| Kos | ≤5ea / hli Kev sib sau ntev ≤ Diameter | Qhov ntev ≤2 * Txoj kab uas hla | NA |
| Txiv kab ntxwv tev / pits / stains / striations / tawg / paug | Tsis muaj | NA | |
| Ntug chips / indents / tawg / hex daim hlau | Tsis muaj | ||
| Polytype cheeb tsam | Tsis muaj | Thaj tsam ≤ 20% | Thaj tsam ≤ 30% |
| Pem hauv ntej laser npav | Tsis muaj | ||
| Back Quality | |||
| Rov qab ua tiav | C-ntsej muag CMP | ||
| Kos | ≤5ea/mm, Qhov ntev ≤2 * Txoj kab uas hla | NA | |
| Back defects (ntug chips / indents) | Tsis muaj | ||
| Rov qab roughness | Ra≤0.2nm (5μm * 5μm) | ||
| Rov qab laser npav | 1mm (los ntawm sab saum toj ntug) | ||
| Ntug | |||
| Ntug | Chamfer | ||
| Ntim | |||
| Ntim | Epi-npaj nrog lub tshuab nqus tsev ntim Multi-wafer cassette ntim | ||
| * Lus Cim: "NA" txhais tau tias tsis muaj kev thov Cov khoom tsis tau hais txog yuav xa mus rau SEMI-STD. | |||
