Tam sim no, cov txheej txheem kev npaj ntawm SiC txheej feem ntau suav nrog gel-sol txoj kev, embedding txoj kev, txhuam txheej txheej txheem, plasma spraying method, chemical gas reaction method (CVR) thiab chemical vapor deposition method (CVD).
Txoj kev embedding:
Cov txheej txheem yog ib hom kub kub khoom theem sintering, uas feem ntau yog siv cov hmoov sib tov ntawm Si hmoov thiab C hmoov raws li cov embedding hmoov, graphite matrix yog muab tso rau hauv cov hmoov embedding, thiab kub sintering yog nqa tawm nyob rau hauv lub inert roj. , thiab thaum kawg lub SiC txheej yog tau nyob rau saum npoo ntawm graphite matrix.Cov txheej txheem yog qhov yooj yim thiab kev sib xyaw ua ke ntawm cov txheej txheej thiab cov substrate yog qhov zoo, tab sis qhov sib xws ntawm txheej raws li cov thickness kev taw qhia tsis zoo, uas yog ib qho yooj yim los tsim ntau qhov thiab ua rau tsis zoo oxidation tsis kam.
Txhuam txheej txheej txheem:
Cov txheej txheem txhuam txheej yog tsuas yog txhuam cov kua raw khoom ntawm qhov chaw ntawm graphite matrix, thiab tom qab ntawd kho cov khoom siv raw ntawm qhov kub thiab txias los npaj cov txheej.Cov txheej txheem yog qhov yooj yim thiab tus nqi qis, tab sis cov txheej txheem npaj los ntawm txhuam txheej txheej tsis muaj zog ua ke nrog cov substrate, txheej txheej tsis zoo, cov txheej yog nyias thiab oxidation tsis kam, thiab lwm yam kev xav tau los pab. nws.
Plasma txau txoj kev:
Cov txheej txheem plasma txau yog tsuas yog tshuaj tsuag cov khoom siv los yog cov khoom siv semi-melted rau saum npoo ntawm cov graphite matrix nrog rab phom plasma, thiab tom qab ntawd ua kom khov thiab sib zog los tsim cov txheej txheem.Txoj kev no yooj yim rau kev khiav lag luam thiab tuaj yeem npaj cov txheej txheem silicon carbide, tab sis cov txheej txheem silicon carbide npaj los ntawm cov txheej txheem feem ntau tsis muaj zog thiab ua rau tsis muaj zog oxidation, yog li nws feem ntau yog siv rau kev npaj ntawm SiC composite txheej los txhim kho. qhov zoo ntawm cov txheej.
Gel-sol txoj kev:
Txoj kev gel-sol feem ntau yog los npaj ib qho kev sib xyaw thiab pob tshab sol tov npog qhov chaw ntawm matrix, ziab rau hauv gel thiab ces sintering kom tau ib txheej.Txoj kev no yooj yim rau kev khiav lag luam thiab tsis tshua muaj nqi, tab sis cov txheej txheem tsim muaj qee qhov tsis zoo xws li thermal shock tsis kam thiab yooj yim tawg, yog li nws tsis tuaj yeem siv dav.
Chemical Gas Reaction (CVR):
CVR feem ntau tsim SiC txheej los ntawm kev siv Si thiab SiO2 hmoov los tsim SiO chav ntawm qhov kub thiab txias, thiab cov tshuaj lom neeg tshwm sim nyob rau saum npoo ntawm C cov ntaub ntawv substrate.SiC txheej npaj los ntawm txoj kev no yog sib txuas nrog rau lub substrate, tab sis cov tshuaj tiv thaiv kub yog siab dua thiab tus nqi siab dua.
Chemical Vapor Deposition (CVD):
Tam sim no, CVD yog lub thev naus laus zis tseem ceeb rau kev npaj SiC txheej rau ntawm qhov chaw substrate.Cov txheej txheem tseem ceeb yog cov tshuaj tiv thaiv lub cev thiab tshuaj lom neeg ntawm cov khoom siv roj theem reactant ntawm lub substrate nto, thiab thaum kawg SiC txheej yog npaj los ntawm deposition ntawm lub substrate nto.SiC txheej npaj los ntawm CVD thev naus laus zis tau sib raug zoo rau saum npoo ntawm substrate, uas tuaj yeem txhim kho oxidation tsis kam thiab ablative tsis kam ntawm cov khoom siv substrate, tab sis lub sij hawm tso tawm ntawm txoj kev no ntev dua, thiab cov tshuaj tiv thaiv roj muaj qee yam tshuaj lom. gas.
Post lub sij hawm: Nov-06-2023