Semiceratxaus siab muab covPFA Cassette, qhov kev xaiv zoo tshaj plaws rau kev tuav wafer nyob rau hauv ib puag ncig uas muaj tshuaj tiv thaiv thiab kav ntev yog qhov tseem ceeb. Crafted los ntawm high-purity Perfluoroalkoxy (PFA) cov ntaub ntawv, lub cassette no yog tsim los tiv thaiv cov feem ntau xav tau tej yam kev mob nyob rau hauv ib tug semiconductor fabrication, kom muaj kev ruaj ntseg thiab kev ncaj ncees ntawm koj wafers.
Tsis sib haum tshuaj tiv thaivCovPFA Cassetteyog engineered los muab superior tsis kam mus rau ntau yam tshuaj, ua rau nws zoo meej xaiv rau cov txheej txheem uas muaj aggressive acids, kuab tshuaj, thiab lwm yam hnyav tshuaj. Qhov kev tiv thaiv tshuaj tiv thaiv zoo no ua kom ntseeg tau tias lub cassette tseem nyob ruaj khov thiab ua haujlwm txawm tias nyob hauv qhov chaw corrosive tshaj plaws, yog li ncua nws txoj sia thiab txo qhov xav tau kev hloov pauv ntau zaus.
High-Purity SivSemicera covPFA Cassetteyog tsim los ntawm ultra-ntshiab PFA cov ntaub ntawv, uas yog ib qho tseem ceeb rau kev tiv thaiv kom txhob muaj kab mob thaum lub sij hawm wafer ua. Qhov kev tsim kho siab-purity no txo qis qhov kev pheej hmoo ntawm cov khoom tsim thiab cov tshuaj leaching, kom ntseeg tau tias koj cov wafers raug tiv thaiv los ntawm impurities uas tuaj yeem cuam tshuam lawv qhov zoo.
Enhanced Durability thiab PerformanceTsim los rau durability, lubPFA Cassettetuav nws cov txheej txheem kev ncaj ncees nyob rau hauv huab cua kub thiab kev ua haujlwm nruj. Txawm hais tias raug kub los yog raug rov ua dua, lub cassette no khaws nws cov duab thiab kev ua tau zoo, muab kev cia siab rau lub sijhawm ntev hauv kev xav tau kev tsim khoom.
Precision Engineering rau kev ruaj ntseg tuavCovSemicera PFA Cassettenta precision engineering uas ua kom muaj kev ruaj ntseg thiab ruaj khov wafer tuav. Txhua qhov yog ua tib zoo tsim los tuav wafers ruaj ntseg hauv qhov chaw, tiv thaiv kev txav los yog hloov pauv uas tuaj yeem ua rau muaj kev puas tsuaj. Qhov no precision engineering txhawb kev sib raug zoo thiab raug wafer tso, pab rau tag nrho cov txheej txheem efficiency.
Kev siv ntau yam hla cov txheej txheemTsaug rau nws superior khoom zog, lubPFA CassetteNws yog ntau yam txaus siv nyob rau hauv ntau theem ntawm semiconductor fabrication. Nws yog qhov tshwj xeeb zoo rau kev ntub dej etching, tshuaj lom neeg vapor deposition (CVD), thiab lwm yam txheej txheem uas cuam tshuam rau qhov hnyav hnyav. Nws adaptability ua rau nws yog ib qho tseem ceeb hauv kev tswj cov txheej txheem kev ncaj ncees thiab wafer zoo.
Kev cog lus rau kev ua tau zoo thiab kev tsim kho tshiabNtawm Semicera, peb tau cog lus los muab cov khoom lag luam uas ua tau raws li cov qauv kev lag luam siab tshaj plaws. CovPFA Cassetteua piv txwv qhov kev cog lus no, muab cov kev daws teeb meem txhim khu kev qha uas sib koom ua ke hauv koj cov txheej txheem tsim khoom. Txhua lub cassette raug tswj xyuas nruj kom ntseeg tau tias nws ua tau raws li peb cov txheej txheem kev ua tau zoo, xa cov kev ua tau zoo uas koj xav tau los ntawm Semicera.
| Cov khoom | Ntau lawm | Kev tshawb fawb | Dummy |
| Crystal Parameters | |||
| Polytype | 4H | ||
| Deg orientation yuam kev | 11-20 > 4 ± 0.15 ° | ||
| Hluav taws xob Parameters | |||
| Dopant | n-hom Nitrogen | ||
| Kev tiv thaiv | 0.015-0.025ohm · cm | ||
| Mechanical Parameters | |||
| Txoj kab uas hla | 150.0 ± 0.2 hli | ||
| Thickness | 350 ± 25 hli | ||
| Lub hauv paus tiaj tus taw qhia | [1-100] ± 5° | ||
| Thawj lub tiaj tiaj ntev | 47.5 ± 1.5 hli | ||
| Secondary flat | Tsis muaj | ||
| TTV | ≤ 5 hli | ≤10 hli | ≤ 15 hli |
| LTV | ≤ 3 μm (5mm * 5mm) | ≤ 5 μm (5mm * 5mm) | ≤ 10 μm (5mm * 5mm) |
| Hneev | -15μm ~ 15μm | -35μm ~ 35μm | -45μm ~ 45μm |
| Warp | ≤ 35 hli | ≤ 45 hli | ≤ 55 hli |
| Pem hauv ntej (Si-face) roughness (AFM) | Ra≤0.2nm (5μm * 5μm) | ||
| Qauv | |||
| Micropipe ceev | <1 ea/cm2 | <10 ea/cm2 | <15 ea/cm2 |
| Hlau impurities | ≤5E10 atoms/cm2 | NA | |
| BPD | ≤1500 ea/cm2 | ≤3000 ea/cm2 | NA |
| TSD | ≤500 ea/cm2 | ≤1000 ea/cm2 | NA |
| Pem hauv ntej zoo | |||
| Pem hauv ntej | Si | ||
| Nto tiav | Lub ntsej muag CMP | ||
| Cov khoom | ≤60ea / wafer (qhov loj ≥0.3μm) | NA | |
| Kos | ≤5ea / hli Kev sib sau ntev ≤ Diameter | Qhov ntev ≤2 * Txoj kab uas hla | NA |
| Txiv kab ntxwv tev / pits / stains / striations / tawg / paug | Tsis muaj | NA | |
| Ntug chips / indents / tawg / hex daim hlau | Tsis muaj | ||
| Polytype cheeb tsam | Tsis muaj | Thaj tsam ≤ 20% | Thaj tsam ≤ 30% |
| Pem hauv ntej laser npav | Tsis muaj | ||
| Back Quality | |||
| Rov qab ua tiav | C-ntsej muag CMP | ||
| Kos | ≤5ea/mm, Qhov ntev ≤2 * Txoj kab uas hla | NA | |
| Back defects (ntug chips / indents) | Tsis muaj | ||
| Rov qab roughness | Ra≤0.2nm (5μm * 5μm) | ||
| Rov qab laser npav | 1mm (los ntawm sab saum toj ntug) | ||
| Ntug | |||
| Ntug | Chamfer | ||
| Ntim | |||
| Ntim | Epi-npaj nrog lub tshuab nqus tsev ntim Multi-wafer cassette ntim | ||
| * Lus Cim: "NA" txhais tau tias tsis muaj kev thov Cov khoom tsis tau hais txog yuav xa mus rau SEMI-STD. | |||
