Silicon ntawm Insulator Waferslos ntawm Semicera yog tsim los ua kom tau raws li qhov kev thov loj hlob rau kev ua tau zoo ntawm cov khoom siv semiconductor. Peb SOI wafers muaj kev ua tau zoo ntawm hluav taws xob thiab txo cov kab mob parasitic capacitance, ua rau lawv zoo tagnrho rau cov ntawv thov siab heev xws li MEMS li, sensors, thiab kev sib xyaw ua ke. Semicera qhov kev txawj ntse hauv wafer ntau lawm ua kom txhua tusSIB wafermuab kev ntseeg siab, ua tau zoo rau koj cov kev xav tau ntawm kev siv technology tshiab.
PebSilicon ntawm Insulator Wafersmuab qhov zoo sib npaug ntawm cov nqi-zoo thiab kev ua haujlwm. Nrog rau soi wafer tus nqi dhau los ua kev sib tw, cov wafers no tau siv dav hauv ntau qhov kev lag luam, suav nrog microelectronics thiab optoelectronics. Semicera cov txheej txheem kev tsim khoom siab tau lees paub zoo tshaj wafer bonding thiab uniformity, ua rau lawv haum rau ntau yam kev siv, los ntawm kab noj hniav SOI wafers rau standard silicon wafers.
Cov yam ntxwv tseem ceeb:
•High-quality SOI wafers optimized rau kev ua tau zoo hauv MEMS thiab lwm yam kev siv.
•Kev sib tw soi wafer nqi rau cov lag luam nrhiav kev daws teeb meem zoo yam tsis muaj kev cuam tshuam zoo.
•Qhov zoo tshaj plaws rau cov thev naus laus zis thev naus laus zis, muab cov hluav taws xob sib cais thiab kev ua haujlwm zoo hauv silicon ntawm cov tshuab hluav taws xob.
PebSilicon ntawm Insulator Wafersyog engineered los muab cov kev daws teeb meem siab, txhawb cov nthwv dej tom ntej ntawm innovation hauv semiconductor technology. Seb koj tab tom ua haujlwm ntawm kab noj hniavSOI wafers, MEMS li, los yog silicon ntawm cov khoom siv insulator, Semicera muab cov wafers ua tau raws li cov qauv siab tshaj plaws hauv kev lag luam.
Cov khoom | Ntau lawm | Kev tshawb fawb | Dummy |
Crystal Parameters | |||
Polytype | 4H | ||
Deg orientation yuam kev | 11-20 > 4 ± 0.15 ° | ||
Hluav taws xob Parameters | |||
Dopant | n-hom Nitrogen | ||
Kev tiv thaiv | 0.015-0.025ohm · cm | ||
Mechanical Parameters | |||
Txoj kab uas hla | 150.0 ± 0.2 hli | ||
Thickness | 350 ± 25 hli | ||
Thawj qhov chaw tiaj tiaj | [1-100] ± 5° | ||
Thawj lub tiaj tiaj ntev | 47.5 ± 1.5 hli | ||
Secondary flat | Tsis muaj | ||
TTV | ≤ 5 hli | ≤10 hli | ≤ 15 hli |
LTV | ≤ 3 μm (5mm * 5mm) | ≤ 5 μm (5mm * 5mm) | ≤ 10 μm (5mm * 5mm) |
Hneev | -15μm ~ 15μm | -35μm ~ 35μm | -45μm ~ 45μm |
Warp | ≤ 35 hli | ≤ 45 hli | ≤ 55 hli |
Pem hauv ntej (Si-face) roughness (AFM) | Ra≤0.2nm (5μm * 5μm) | ||
Qauv | |||
Micropipe ceev | <1 ea/cm2 | <10 ea/cm2 | <15 ea/cm2 |
Hlau impurities | ≤5E10 atoms/cm2 | NA | |
BPD | ≤1500 ea/cm2 | ≤3000 ea/cm2 | NA |
TSD | ≤500 ea/cm2 | ≤1000 ea/cm2 | NA |
Pem hauv ntej zoo | |||
Pem hauv ntej | Si | ||
Nto tiav | Lub ntsej muag CMP | ||
Cov khoom | ≤60ea / wafer (qhov loj ≥0.3μm) | NA | |
Kos | ≤5ea / hli Kev sib sau ntev ≤ Diameter | Qhov ntev ≤2 * Txoj kab uas hla | NA |
Txiv kab ntxwv tev / pits / stains / striations / tawg / paug | Tsis muaj | NA | |
Ntug chips / indents / tawg / hex daim hlau | Tsis muaj | ||
Polytype cheeb tsam | Tsis muaj | Thaj tsam ≤ 20% | Thaj tsam ≤ 30% |
Pem hauv ntej laser npav | Tsis muaj | ||
Back Quality | |||
Rov qab ua tiav | C-ntsej muag CMP | ||
Kos | ≤5ea/mm, Qhov ntev ≤2 * Txoj kab uas hla | NA | |
Back defects (ntug chips / indents) | Tsis muaj | ||
Rov qab roughness | Ra≤0.2nm (5μm * 5μm) | ||
Rov qab laser npav | 1mm (los ntawm sab saum toj ntug) | ||
Ntug | |||
Ntug | Chamfer | ||
Ntim | |||
Ntim | Epi-npaj nrog lub tshuab nqus tsev ntim Multi-wafer cassette ntim | ||
* Lus Cim: "NA" txhais tau tias tsis muaj kev thov Cov khoom tsis tau hais txog yuav xa mus rau SEMI-STD. |