Semicera's SOI Wafer (Silicon On Insulator) yog tsim los xa cov hluav taws xob zoo tshaj plaws thiab kev ua haujlwm thermal. Cov qauv wafer tshiab no, muaj cov txheej txheem silicon ntawm cov txheej txheej insulating, ua kom cov cuab yeej ua tau zoo thiab txo qis zog, ua rau nws zoo tagnrho rau ntau yam kev siv high-tech.
Peb SOI wafers muab cov txiaj ntsig tshwj xeeb rau kev sib koom ua ke los ntawm kev txo cov kab mob cab thiab txhim kho cov cuab yeej ceev thiab kev ua haujlwm. Qhov no yog qhov tseem ceeb rau cov khoom siv hluav taws xob niaj hnub no, qhov kev ua haujlwm siab thiab kev siv hluav taws xob yog qhov tseem ceeb rau cov neeg siv khoom thiab kev siv khoom siv.
Semicera ntiav cov txheej txheem kev tsim khoom siab heev los tsim SOI wafers nrog zoo ib yam thiab kev ntseeg tau. Cov wafers no muab cov thermal rwb thaiv tsev zoo heev, ua rau lawv haum rau siv nyob rau hauv ib puag ncig uas kub dissipation yog ib qho kev txhawj xeeb, xws li nyob rau hauv high-density electronics thiab lub hwj chim tswj systems.
Kev siv SOI wafers hauv semiconductor fabrication tso cai rau kev tsim cov chips me, sai dua, thiab txhim khu kev qha. Semicera txoj kev cog lus rau kev ua haujlwm zoo ua kom ntseeg tau tias peb SOI wafers ua tau raws li cov qauv siab uas yuav tsum tau muaj rau kev siv thev naus laus zis hauv kev lag luam xws li kev sib txuas lus, tsheb, thiab cov khoom siv hluav taws xob.
Xaiv Semicera's SOI Wafer txhais tau tias kev nqis peev hauv cov khoom lag luam uas txhawb nqa kev nce qib ntawm cov tshuab hluav taws xob thiab microelectronic technologies. Peb cov wafers yog tsim los muab kev txhim kho kev ua tau zoo thiab ua haujlwm ntev, pab txhawb rau kev ua tiav ntawm koj cov haujlwm ua haujlwm siab thiab ua kom ntseeg tau tias koj nyob ntawm qhov ua ntej ntawm kev tsim kho tshiab.
| Cov khoom | Ntau lawm | Kev tshawb fawb | Dummy |
| Crystal Parameters | |||
| Polytype | 4H | ||
| Deg orientation yuam kev | 11-20 > 4 ± 0.15 ° | ||
| Hluav taws xob Parameters | |||
| Dopant | n-hom Nitrogen | ||
| Kev tiv thaiv | 0.015-0.025ohm · cm | ||
| Mechanical Parameters | |||
| Txoj kab uas hla | 150.0 ± 0.2 hli | ||
| Thickness | 350 ± 25 hli | ||
| Thawj qhov chaw tiaj tiaj | [1-100] ± 5° | ||
| Thawj lub tiaj tiaj ntev | 47.5 ± 1.5 hli | ||
| Secondary flat | Tsis muaj | ||
| TTV | ≤ 5 hli | ≤10 hli | ≤ 15 hli |
| LTV | ≤ 3 μm (5mm * 5mm) | ≤ 5 μm (5mm * 5mm) | ≤ 10 μm (5mm * 5mm) |
| Hneev | -15μm ~ 15μm | -35μm ~ 35μm | -45μm ~ 45μm |
| Warp | ≤ 35 hli | ≤ 45 hli | ≤ 55 hli |
| Pem hauv ntej (Si-face) roughness (AFM) | Ra≤0.2nm (5μm * 5μm) | ||
| Qauv | |||
| Micropipe ceev | <1 ea/cm2 | <10 ea/cm2 | <15 ea/cm2 |
| Hlau impurities | ≤5E10 atoms/cm2 | NA | |
| BPD | ≤1500 ea/cm2 | ≤3000 ea/cm2 | NA |
| TSD | ≤500 ea/cm2 | ≤1000 ea/cm2 | NA |
| Pem hauv ntej zoo | |||
| Pem hauv ntej | Si | ||
| Nto tiav | Lub ntsej muag CMP | ||
| Cov khoom | ≤60ea / wafer (qhov loj ≥0.3μm) | NA | |
| Kos | ≤5ea / hli Kev sib sau ntev ≤ Diameter | Qhov ntev ≤2 * Txoj kab uas hla | NA |
| Txiv kab ntxwv tev / pits / stains / striations / tawg / paug | Tsis muaj | NA | |
| Ntug chips / indents / tawg / hex daim hlau | Tsis muaj | ||
| Polytype cheeb tsam | Tsis muaj | Thaj tsam ≤ 20% | Thaj tsam ≤ 30% |
| Pem hauv ntej laser npav | Tsis muaj | ||
| Back Quality | |||
| Rov qab ua tiav | C-ntsej muag CMP | ||
| Kos | ≤5ea/mm, Qhov ntev ≤2 * Txoj kab uas hla | NA | |
| Back defects (ntug chips / indents) | Tsis muaj | ||
| Rov qab roughness | Ra≤0.2nm (5μm * 5μm) | ||
| Rov qab laser npav | 1mm (los ntawm sab saum toj ntug) | ||
| Ntug | |||
| Ntug | Chamfer | ||
| Ntim | |||
| Ntim | Epi-npaj nrog lub tshuab nqus tsev ntim Multi-wafer cassette ntim | ||
| * Lus Cim: "NA" txhais tau tias tsis muaj kev thov Cov khoom tsis tau hais txog yuav xa mus rau SEMI-STD. | |||
