Semicera nthuav qhia kev lag luam-kev ua lag luamWafer Carriers, engineered los muab kev tiv thaiv superior thiab seamless kev thauj mus los ntawm ilv semiconductor wafers hla ntau theem ntawm kev tsim khoom. PebWafer Carriersyog tsim los ua kom tau raws li qhov xav tau ntawm cov khoom siv niaj hnub semiconductor, kom ntseeg tau tias kev ncaj ncees thiab zoo ntawm koj cov wafers raug tswj xyuas txhua lub sijhawm.
Cov yam ntxwv tseem ceeb:
• Khoom siv hwm zoo tsim:Crafted los ntawm cov khoom zoo, tsis muaj paug-resistant cov ntaub ntawv uas lav cov kav ntev thiab ntev, ua rau lawv zoo tagnrho rau chav huv huv.
•Precision Tsim:Features meej qhov sib dhos thiab ruaj ntseg tuav mechanisms tiv thaiv wafer slippage thiab puas thaum tuav thiab tsheb thauj mus los.
•Versatile Compatibility:Txaus siab rau ntau yam ntawm wafer qhov ntau thiab tsawg, muab kev yooj yim rau ntau yam kev siv semiconductor.
•Ergonomic tuav:Lub teeb yuag thiab tus neeg siv-phooj ywg tsim ua kom yooj yim thauj khoom thiab tshem tawm, txhim kho kev ua haujlwm zoo thiab txo lub sijhawm tuav.
•Customizable Options:Muab kev hloov kho kom tau raws li cov kev xav tau tshwj xeeb, suav nrog kev xaiv cov khoom siv, hloov kho qhov loj me, thiab sau npe rau kev ua haujlwm zoo sib xws.
Txhim kho koj cov txheej txheem tsim khoom semiconductor nrog Semicera'sWafer Carriers, qhov zoo tshaj plaws kev daws teeb meem rau kev tiv thaiv koj wafers tiv thaiv kev sib kis thiab kev puas tsuaj. Cia siab rau peb txoj kev cog lus rau kev ua tau zoo thiab kev tsim kho tshiab kom xa cov khoom lag luam uas tsis yog tsuas yog ua tau raws li tab sis dhau cov qauv kev lag luam, kom ntseeg tau tias koj cov haujlwm ua haujlwm tau zoo thiab muaj txiaj ntsig.
| Cov khoom | Ntau lawm | Kev tshawb fawb | Dummy |
| Crystal Parameters | |||
| Polytype | 4H | ||
| Deg orientation yuam kev | 11-20 > 4 ± 0.15 ° | ||
| Hluav taws xob Parameters | |||
| Dopant | n-hom Nitrogen | ||
| Kev tiv thaiv | 0.015-0.025ohm · cm | ||
| Mechanical Parameters | |||
| Txoj kab uas hla | 150.0 ± 0.2 hli | ||
| Thickness | 350 ± 25 hli | ||
| Lub hauv paus tiaj tus taw qhia | [1-100] ± 5° | ||
| Thawj lub tiaj tiaj ntev | 47.5 ± 1.5 hli | ||
| Secondary flat | Tsis muaj | ||
| TTV | ≤ 5 hli | ≤10 hli | ≤ 15 hli |
| LTV | ≤ 3 μm (5mm * 5mm) | ≤ 5 μm (5mm * 5mm) | ≤ 10 μm (5mm * 5mm) |
| Hneev | -15μm ~ 15μm | -35μm ~ 35μm | -45μm ~ 45μm |
| Warp | ≤ 35 hli | ≤ 45 hli | ≤ 55 hli |
| Pem hauv ntej (Si-face) roughness (AFM) | Ra≤0.2nm (5μm * 5μm) | ||
| Qauv | |||
| Micropipe ceev | <1 ea/cm2 | <10 ea/cm2 | <15 ea/cm2 |
| Hlau impurities | ≤5E10 atoms/cm2 | NA | |
| BPD | ≤1500 ea/cm2 | ≤3000 ea/cm2 | NA |
| TSD | ≤500 ea/cm2 | ≤1000 ea/cm2 | NA |
| Pem hauv ntej zoo | |||
| Pem hauv ntej | Si | ||
| Nto tiav | Lub ntsej muag CMP | ||
| Cov khoom | ≤60ea / wafer (qhov loj ≥0.3μm) | NA | |
| Kos | ≤5ea / hli Kev sib sau ntev ≤ Diameter | Qhov ntev ≤2 * Txoj kab uas hla | NA |
| Txiv kab ntxwv tev / pits / stains / striations / tawg / paug | Tsis muaj | NA | |
| Ntug chips / indents / tawg / hex daim hlau | Tsis muaj | ||
| Polytype cheeb tsam | Tsis muaj | Thaj tsam ≤ 20% | Thaj tsam ≤ 30% |
| Pem hauv ntej laser npav | Tsis muaj | ||
| Back Quality | |||
| Rov qab ua tiav | C-ntsej muag CMP | ||
| Kos | ≤5ea/mm, Qhov ntev ≤2 * Txoj kab uas hla | NA | |
| Back defects (ntug chips / indents) | Tsis muaj | ||
| Rov qab roughness | Ra≤0.2nm (5μm * 5μm) | ||
| Rov qab laser npav | 1mm (los ntawm sab saum toj ntug) | ||
| Ntug | |||
| Ntug | Chamfer | ||
| Ntim | |||
| Ntim | Epi-npaj nrog lub tshuab nqus tsev ntim Multi-wafer cassette ntim | ||
| * Lus Cim: "NA" txhais tau tias tsis muaj kev thov Cov khoom tsis tau hais txog yuav xa mus rau SEMI-STD. | |||
