Semicera qhia covWafer Cassette Carrier, ib qho kev daws teeb meem tseem ceeb rau kev ruaj ntseg thiab siv tau zoo ntawm cov khoom siv hluav taws xob semiconductor wafers. Cov cab kuj no yog tsim los ua kom tau raws li cov kev cai nruj ntawm kev lag luam semiconductor, ua kom muaj kev tiv thaiv thiab kev ncaj ncees ntawm koj cov wafers thoob plaws hauv kev tsim khoom.
Cov yam ntxwv tseem ceeb:
•Kev tsim kho muaj zog:CovWafer Cassette Carrieryog tsim los ntawm cov khoom siv zoo, cov khoom siv ruaj khov uas tiv taus qhov nruj ntawm ib puag ncig semiconductor, muab kev tiv thaiv kev tiv thaiv kev sib kis thiab kev puas tsuaj rau lub cev.
•Precise Alignment:Tsim los rau kev sib raug zoo ntawm wafer, tus neeg nqa khoom no ua kom cov wafers ruaj ntseg nyob rau hauv qhov chaw, txo qhov kev pheej hmoo ntawm misalignment lossis kev puas tsuaj thaum thauj.
•Yooj yim tuav:Ergonomically tsim los yooj yim ntawm kev siv, tus neeg nqa khoom yooj yim rau kev thauj khoom thiab tshem tawm cov txheej txheem, txhim kho kev ua haujlwm ntawm kev ua haujlwm hauv chav huv.
•Compatibility:Tau tshaj ntau yam ntawm wafer qhov ntau thiab tsawg thiab hom, ua rau nws muaj ntau yam rau ntau yam kev tsim khoom semiconductor.
Muaj kev tiv thaiv tsis sib xws thiab yooj yim nrog Semicera'sWafer Cassette Carrier. Peb cov cab kuj yog tsim los ua kom tau raws li cov qauv siab tshaj plaws ntawm kev tsim khoom semiconductor, kom ntseeg tau tias koj cov wafers nyob twj ywm nyob rau hauv pristine mob txij thaum pib mus rau tag. Cia siab rau Semicera kom xa cov khoom zoo thiab kev ntseeg siab uas koj xav tau rau koj cov txheej txheem tseem ceeb tshaj plaws.
| Cov khoom | Ntau lawm | Kev tshawb fawb | Dummy |
| Crystal Parameters | |||
| Polytype | 4H | ||
| Deg orientation yuam kev | 11-20 > 4 ± 0.15 ° | ||
| Hluav taws xob Parameters | |||
| Dopant | n-hom Nitrogen | ||
| Kev tiv thaiv | 0.015-0.025ohm · cm | ||
| Mechanical Parameters | |||
| Txoj kab uas hla | 150.0 ± 0.2 hli | ||
| Thickness | 350 ± 25 hli | ||
| Thawj qhov chaw tiaj tiaj | [1-100] ± 5° | ||
| Thawj lub tiaj tiaj ntev | 47.5 ± 1.5 hli | ||
| Secondary flat | Tsis muaj | ||
| TTV | ≤ 5 hli | ≤10 hli | ≤ 15 hli |
| LTV | ≤ 3 μm (5mm * 5mm) | ≤ 5 μm (5mm * 5mm) | ≤ 10 μm (5mm * 5mm) |
| Hneev | -15μm ~ 15μm | -35μm ~ 35μm | -45μm ~ 45μm |
| Warp | ≤ 35 hli | ≤ 45 hli | ≤ 55 hli |
| Pem hauv ntej (Si-face) roughness (AFM) | Ra≤0.2nm (5μm * 5μm) | ||
| Qauv | |||
| Micropipe ceev | <1 ea/cm2 | <10 ea/cm2 | <15 ea/cm2 |
| Hlau impurities | ≤5E10 atoms/cm2 | NA | |
| BPD | ≤1500 ea/cm2 | ≤3000 ea/cm2 | NA |
| TSD | ≤500 ea/cm2 | ≤1000 ea/cm2 | NA |
| Pem hauv ntej zoo | |||
| Pem hauv ntej | Si | ||
| Nto tiav | Lub ntsej muag CMP | ||
| Cov khoom | ≤60ea / wafer (qhov loj ≥0.3μm) | NA | |
| Kos | ≤5ea / hli Kev sib sau ntev ≤ Diameter | Qhov ntev ≤2 * Txoj kab uas hla | NA |
| Txiv kab ntxwv tev / pits / stains / striations / tawg / paug | Tsis muaj | NA | |
| Ntug chips / indents / tawg / hex daim hlau | Tsis muaj | ||
| Polytype cheeb tsam | Tsis muaj | Thaj tsam ≤ 20% | Thaj tsam ≤ 30% |
| Pem hauv ntej laser npav | Tsis muaj | ||
| Back Quality | |||
| Rov qab ua tiav | C-ntsej muag CMP | ||
| Kos | ≤5ea/mm, Qhov ntev ≤2 * Txoj kab uas hla | NA | |
| Back defects (ntug chips / indents) | Tsis muaj | ||
| Rov qab roughness | Ra≤0.2nm (5μm * 5μm) | ||
| Rov qab laser npav | 1mm (los ntawm sab saum toj ntug) | ||
| Ntug | |||
| Ntug | Chamfer | ||
| Ntim | |||
| Ntim | Epi-npaj nrog lub tshuab nqus tsev ntim Multi-wafer cassette ntim | ||
| * Lus Cim: "NA" txhais tau tias tsis muaj kev thov Cov khoom tsis tau hais txog yuav xa mus rau SEMI-STD. | |||
