Semicera covWafer Cassetteyog ib qho tseem ceeb hauv cov txheej txheem tsim khoom semiconductor, tsim kom ruaj ntseg tuav thiab thauj cov khoom siv semiconductor wafers. CovWafer Cassettemuab kev tiv thaiv tshwj xeeb, kom ntseeg tau tias txhua lub wafer khaws cia tsis muaj kab mob thiab kev puas tsuaj rau lub cev thaum tuav, khaws cia, thiab kev thauj mus los.
Tsim los ntawm high-purity, tshuaj-resistant cov ntaub ntawv, lub SemiceraWafer Cassettelav qhov siab tshaj plaws ntawm kev huv thiab kav ntev, qhov tseem ceeb rau kev tswj xyuas kev ncaj ncees ntawm wafers ntawm txhua theem ntawm kev tsim khoom. Lub precision engineering ntawm cov cassettes no tso cai rau seamless kev koom ua ke nrog automated tuav systems, txo qhov kev pheej hmoo ntawm kis kab mob thiab mechanical puas.
Tus tsim ntawm lubWafer Cassettekuj txhawb kev pom huab cua zoo thiab tswj qhov kub thiab txias, uas yog qhov tseem ceeb rau cov txheej txheem uas yuav tsum tau muaj qee qhov xwm txheej. Txawm hais tias siv hauv chav huv lossis thaum ua haujlwm thermal, SemiceraWafer Cassetteyog tsim los ua kom tau raws li cov kev xav tau nruj ntawm kev lag luam semiconductor, muab kev txhim khu kev qha thiab zoo ib yam los txhim kho kev tsim khoom thiab cov khoom zoo.
| Cov khoom | Ntau lawm | Kev tshawb fawb | Dummy |
| Crystal Parameters | |||
| Polytype | 4H | ||
| Deg orientation yuam kev | 11-20 > 4 ± 0.15 ° | ||
| Hluav taws xob Parameters | |||
| Dopant | n-hom Nitrogen | ||
| Kev tiv thaiv | 0.015-0.025ohm · cm | ||
| Mechanical Parameters | |||
| Txoj kab uas hla | 150.0 ± 0.2 hli | ||
| Thickness | 350 ± 25 hli | ||
| Lub hauv paus tiaj tus taw qhia | [1-100] ± 5° | ||
| Thawj lub tiaj tiaj ntev | 47.5 ± 1.5 hli | ||
| Secondary flat | Tsis muaj | ||
| TTV | ≤ 5 hli | ≤10 hli | ≤ 15 hli |
| LTV | ≤ 3 μm (5mm * 5mm) | ≤ 5 μm (5mm * 5mm) | ≤ 10 μm (5mm * 5mm) |
| Hneev | -15μm ~ 15μm | -35μm ~ 35μm | -45μm ~ 45μm |
| Warp | ≤ 35 hli | ≤ 45 hli | ≤ 55 hli |
| Pem hauv ntej (Si-face) roughness (AFM) | Ra≤0.2nm (5μm * 5μm) | ||
| Qauv | |||
| Micropipe ceev | <1 ea/cm2 | <10 ea/cm2 | <15 ea/cm2 |
| Hlau impurities | ≤5E10 atoms/cm2 | NA | |
| BPD | ≤1500 ea/cm2 | ≤3000 ea/cm2 | NA |
| TSD | ≤500 ea/cm2 | ≤1000 ea/cm2 | NA |
| Pem hauv ntej zoo | |||
| Pem hauv ntej | Si | ||
| Nto tiav | Lub ntsej muag CMP | ||
| Cov khoom | ≤60ea / wafer (qhov loj ≥0.3μm) | NA | |
| Kos | ≤5ea / hli Kev sib sau ntev ≤ Diameter | Qhov ntev ≤2 * Txoj kab uas hla | NA |
| Txiv kab ntxwv tev / pits / stains / striations / tawg / paug | Tsis muaj | NA | |
| Ntug chips / indents / tawg / hex daim hlau | Tsis muaj | ||
| Polytype cheeb tsam | Tsis muaj | Thaj tsam ≤ 20% | Thaj tsam ≤ 30% |
| Pem hauv ntej laser npav | Tsis muaj | ||
| Back Quality | |||
| Rov qab ua tiav | C-ntsej muag CMP | ||
| Kos | ≤5ea/mm, Qhov ntev ≤2 * Txoj kab uas hla | NA | |
| Back defects (ntug chips / indents) | Tsis muaj | ||
| Rov qab roughness | Ra≤0.2nm (5μm * 5μm) | ||
| Rov qab laser npav | 1mm (los ntawm sab saum toj ntug) | ||
| Ntug | |||
| Ntug | Chamfer | ||
| Ntim | |||
| Ntim | Epi-npaj nrog lub tshuab nqus tsev ntim Multi-wafer cassette ntim | ||
| * Lus Cim: "NA" txhais tau tias tsis muaj kev thov Cov khoom tsis tau hais txog yuav xa mus rau SEMI-STD. | |||
